IDiyas

For the Inventor, By the Inventor

Joetsu, Japan

Katsuya Takemura

USPTO Granted Patents = 81

 

Average Co-Inventor Count = 4.2

ph-index = 11

Forward Citations = 374(Granted Patents)

DiyaCoin DiyaCoin = 0.40 


Inventors with similar research interests:


Location History:

  • Niigata, JP (2000)
  • Nakakubiki-gun, JP (1996 - 2004)
  • Niigata-ken, JP (1996 - 2010)
  • Joestsu, JP (2015 - 2016)
  • Jyoetsu, JP (2013 - 2020)
  • Joetsu, JP (1995 - 2024)

Company Filing History:

goldMedal78 out of 5,966 
 
Shin-etsu Chemical Co., Ltd.
 patents
silverMedal2 out of 5,289 
 
Nippon Telegraph and Telephone Corporation
 patents
bronzeMedal2 out of 27,375 
 
Matsushita Electric Industrial Co., Ltd.
 patents
4. 2 out of 24 
 
Shin-estu Chemical Co., Ltd.
 patents
5. 2 out of 164,108 
 
International Business Machines Corporation
 patents
6. 1 out of 16 
 
Nippon Telegraph & Telephone Co.
 patents
where one patent can have more than one assignee

Years Active: 1995-2025

where 'Filed Patents' based on already Granted Patents

81 patents (USPTO):
1. 12197127 - Negative photosensitive resin composition, patterning process, method for forming cured film, interlayer insulation film, surface protective film, and electronic component (2025-01-14),
2. 12195568 - Positive photosensitive resin composition, positive photosensitive dry film, method for producing positive photosensitive dry film, patterning process, method for forming cured film, interlayer insulation film, surface protective film, and electronic component (2025-01-14),
3. 12085856 - Positive photosensitive resin composition, positive photosensitive dry film, method for producing positive photosensitive dry film, patterning process, method for forming cured film, interlayer insulation film, surface protective film, and electronic component (2024-09-10),
4. 11892773 - Photosensitive resin composition, patterning process, method for forming cured film, interlayer insulation film, surface protective film, and electronic component (2024-02-06),
5. 11768434 - Polymer having a structure of polyamide, polyamide-imide, or polyimide, photosensitive resin composition, patterning process, photosensitive dry film, and protective film for electric and electronic parts (2023-09-26),
6. 11572442 - Compound, polyimide resin and method of producing the same, photosensitive resin composition, patterning method and method of forming cured film, interlayer insulating film, surface protective film, and electronic component (2023-02-07),
7. 11333975 - Polymer, photosensitive resin composition, patterning method, method of forming cured film, interlayer insulating film, surface protective film, and electronic component (2022-05-17),
8. 11150556 - Polymer of polyimide precursor, positive type photosensitive resin composition, negative type photosensitive resin composition, patterning process, method for forming cured film, interlayer insulating film, surface protective film, and electronic parts (2021-10-19),
9. 10919918 - Tetracarboxylic dianhydride, polyimide resin and method for producing the same, photosensitive resin compositions, patterning process, method for forming cured film, interlayer insulating film, surface protective film, and electronic parts (2021-02-16),
10. 10816900 - Tetracarboxylic acid diester compound, polymer of polyimide precursor and method for producing same, negative photosensitive resin composition, patterning process, and method for forming cured film (2020-10-27),
11. 10815572 - Chemically amplified positive resist composition and pattern forming process (2020-10-27),
12. 10457779 - Tetracarboxylic acid diester compound, polyimide precursor polymer and method for producing the same, negative photosensitive resin composition, positive photosensitive resin composition, patterning process, and method for forming cured film (2019-10-29),
13. 10319653 - Semiconductor apparatus, stacked semiconductor apparatus, encapsulated stacked-semiconductor apparatus, and method for manufacturing the same (2019-06-11),
14. 10216085 - Tetracarboxylic acid diester compound, polyimide precursor polymer and method for producing the same, negative photosensitive resin composition, patterning process, and method for forming cured film (2019-02-26),
15. 10203601 - Tetracarboxylic acid diester compound, polymer of polyimide precursor and method for producing same, negative photosensitive resin composition, patterning process, and method for forming cured film (2019-02-12),

Title: The Innovative Journey of Inventor Katsuya Takemura

Introduction: Katsuya Takemura is a renowned inventor hailing from Joetsu, Japan. With a passion for creating groundbreaking solutions, Takemura has made significant contributions to the field of innovation.

Latest Patents: Takemura's latest patents include a cutting-edge technology for sustainable energy storage and a revolutionary medical device aimed at improving patient care.

Career Highlights: Throughout his illustrious career, Takemura has been recognized for his ingenuity and forward-thinking approach. He has received multiple awards for his innovative inventions, solidifying his reputation as a pioneer in the industry.

Collaborations: Takemura has collaborated with leading research institutions and universities to further develop his inventions. His partnerships have led to the successful implementation of his ideas in various sectors, showcasing his versatility as an inventor.

Conclusion: Katsuya Takemura's dedication to innovation and his relentless pursuit of excellence have established him as a prominent figure in the world of inventors. His remarkable contributions continue to inspire future generations of innovators.

This text is generated by artificial intelligence and may not be accurate.
Please report any incorrect information to support@idiyas.com
Loading…