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C08G 73/10 (2006.01); G03F 7/004 (2006.01); G03F 7/038 (2006.01); G03F 7/039 (2006.01); G03F 7/11 (2006.01); G03F 7/20 (2006.01); G03F 7/32 (2006.01); G03F 7/38 (2006.01); G03F 7/40 (2006.01);

U.S. Cl.

CPC ...

C08G 73/1046 (2013.01); C08G 73/1075 (2013.01); G03F 7/0045 (2013.01); G03F 7/0382 (2013.01); G03F 7/0392 (2013.01); G03F 7/11 (2013.01); G03F 7/2006 (2013.01); G03F 7/322 (2013.01); G03F 7/38 (2013.01); G03F 7/40 (2013.01);

Abstract

A polymer in the present invention contains a structural unit represented by the following general formula (1), where Xis a tetravalent organic group, Zis a divalent organic group, and 'k' is an integer of 1 to 3. Thus, the present invention provides: a positive photosensitive resin composition and a negative photosensitive resin composition which exhibit favorable solvent solubility and are capable of forming a fine pattern with high resolution as a result of solubility in an aqueous alkaline solution; a polyimide-based polymer usable as a base resin for these compositions; and a patterning method and a method for forming a cured film which use the compositions.

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