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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 12195568 B1

PDFFull Text
Date of Patent:
Jan. 14, 2025

Filed:

Feb. 17, 2022

Positive photosensitive resin composition, positive photosensitive dry film, method for producing positive photosensitive dry film, patterning process, method for forming cured film, interlayer insulation film, surface protective film, and electronic component

Applicant:

Shin-etsu Chemical Co., Ltd., Tokyo, JP;

Inventors:

Masashi Iio, Joetsu, JP;

Hiroyuki Urano, Joetsu, JP;

Osamu Watanabe, Joetsu, JP;

Katsuya Takemura, Joetsu, JP;

Assignee:

SHIN-ETSU CHEMICAL CO., LTD., Tokyo, JP;

Attorney:

Oliff PLC

Primary Examiner:

Sean M DeGuire

Assistant Examiner:

Alexander N. Lee

Int. Cl.
CPC ...
C08F 24/00 (2006.01); G03F 7/004 (2006.01); G03F 7/039 (2006.01); G03F 7/11 (2006.01); G03F 7/16 (2006.01); G03F 7/20 (2006.01); G03F 7/32 (2006.01); G03F 7/38 (2006.01);
U.S. Cl.
CPC ...
C08F 24/00 (2013.01); G03F 7/0045 (2013.01); G03F 7/0392 (2013.01); G03F 7/11 (2013.01); G03F 7/162 (2013.01); G03F 7/2006 (2013.01); G03F 7/322 (2013.01); G03F 7/38 (2013.01);
Abstract

A positive photosensitive resin composition including: an alkali-soluble resin containing at least one structure selected from a polyimide structure, a polyamide structure, a polybenzoxazole structure, a polyamide-imide structure, and a precursor structure thereof, a polymer compound having a structural unit formed by cyclopolymerization, and a compound having a quinonediazide structure for serving as a photosensitizer to generate an acid by light and increase a dissolution speed to an alkaline aqueous solution.

Find Patent Forward Citations

Iio, Masashi. (2025). Positive photosensitive resin composition, positive photosensitive dry film, method for producing positive photosensitive dry film, patterning process, method for forming cured film, interlayer insulation film, surface protective film, and electronic component (U.S. Patent No. 12195568). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12195568

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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