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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10919918 B1

PDFFull Text
Date of Patent:
Feb. 16, 2021

Filed:

Nov. 20, 2018

Tetracarboxylic dianhydride, polyimide resin and method for producing the same, photosensitive resin compositions, patterning process, method for forming cured film, interlayer insulating film, surface protective film, and electronic parts

Applicant:

Shin-etsu Chemical Co., Ltd., Tokyo, JP;

Inventors:

Hiroyuki Urano, Joetsu, JP;

Hiroki Takano, Joetsu, JP;

Masashi Iio, Joetsu, JP;

Katsuya Takemura, Joetsu, JP;

Kazuya Honda, Joetsu, JP;

Assignee:

SHIN-ETSU CHEMICAL CO., LTD., Tokyo, JP;

Attorney:

Oliff PLC

Primary Examiner:

Anca Eoff

Int. Cl.
CPC ...
C07F 7/08 (2006.01); C08G 73/10 (2006.01); G03F 7/039 (2006.01); G03F 7/038 (2006.01); C08G 77/46 (2006.01); G03F 7/075 (2006.01); G03F 7/023 (2006.01); C08G 77/04 (2006.01); C09D 179/08 (2006.01); G03F 7/32 (2006.01); G03F 7/16 (2006.01); G03F 7/20 (2006.01);
U.S. Cl.
CPC ...
C07F 7/0814 (2013.01); C08G 73/106 (2013.01); C08G 73/1007 (2013.01); C08G 73/1039 (2013.01); C08G 73/1042 (2013.01); C08G 73/1046 (2013.01); C08G 73/1053 (2013.01); C08G 73/1078 (2013.01); C08G 73/1085 (2013.01); C08G 77/045 (2013.01); C08G 77/46 (2013.01); C09D 179/08 (2013.01); G03F 7/0233 (2013.01); G03F 7/038 (2013.01); G03F 7/039 (2013.01); G03F 7/0387 (2013.01); G03F 7/0757 (2013.01); G03F 7/16 (2013.01); G03F 7/20 (2013.01); G03F 7/322 (2013.01);
Abstract

An object of the present invention is to provide: a tetracarboxylic dianhydride which can lead to a polyimide usable as a base resin of a photosensitive resin composition capable of forming a fine pattern and obtaining high resolution without impairing excellent characteristics such as mechanical strength and adhesiveness; a polyimide resin obtained by using the tetracarboxylic dianhydride; and a method for producing the polyimide resin. The tetracarboxylic dianhydride is shown by the following general formula (1).

Find Patent Forward Citations

Urano, Hiroyuki. (2021). Tetracarboxylic dianhydride, polyimide resin and method for producing the same, photosensitive resin compositions, patterning process, method for forming cured film, interlayer insulating film, surface protective film, and electronic parts (U.S. Patent No. 10919918). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/10919918

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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