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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 11150556 B1

PDFFull Text
Date of Patent:
Oct. 19, 2021

Filed:

Mar. 12, 2018

Polymer of polyimide precursor, positive type photosensitive resin composition, negative type photosensitive resin composition, patterning process, method for forming cured film, interlayer insulating film, surface protective film, and electronic parts

Applicant:

Shin-etsu Chemical Co., Ltd., Tokyo, JP;

Inventors:

Katsuya Takemura, Joetsu, JP;

Hiroyuki Urano, Joetsu, JP;

Masashi Iio, Joetsu, JP;

Assignee:

SHIN-ETSU CHEMICAL CO., LTD., Tokyo, JP;

Attorney:

Oliff PLC

Primary Examiner:

John S Chu

Int. Cl.
CPC ...
G03F 7/004 (2006.01); G03F 7/023 (2006.01); G03F 7/039 (2006.01); G03F 7/038 (2006.01); G03F 7/30 (2006.01); C08G 73/12 (2006.01); C08G 73/10 (2006.01); C08G 73/14 (2006.01); G03F 7/40 (2006.01); G03F 7/32 (2006.01); G03F 7/20 (2006.01); C09D 179/08 (2006.01); G03F 7/38 (2006.01);
U.S. Cl.
CPC ...
G03F 7/0233 (2013.01); C08G 73/1039 (2013.01); C08G 73/1042 (2013.01); C08G 73/1071 (2013.01); C08G 73/12 (2013.01); C08G 73/14 (2013.01); C09D 179/08 (2013.01); G03F 7/0387 (2013.01); G03F 7/0388 (2013.01); G03F 7/0392 (2013.01); G03F 7/20 (2013.01); G03F 7/30 (2013.01); G03F 7/322 (2013.01); G03F 7/38 (2013.01); G03F 7/40 (2013.01);
Abstract

This is to provide a polymer of a polyimide precursor which is soluble in an aqueous alkaline solution, and capable of using a base resin of a positive type and negative type photosensitive resin composition which is capable of forming a fine pattern and obtaining high resolution. Also provided is a positive type and negative type photosensitive resin composition using such a polymer of a polyimide precursor. Further provided are a patterning process and a method of forming a cured film using the composition.

Find Patent Forward Citations

Takemura, Katsuya. (2021). Polymer of polyimide precursor, positive type photosensitive resin composition, negative type photosensitive resin composition, patterning process, method for forming cured film, interlayer insulating film, surface protective film, and electronic parts (U.S. Patent No. 11150556). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/11150556

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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