Average Co-Inventor Count = 4.16
ph-index = 11
The patent ph-index is calculated by counting the number of publications for which an author has been cited by other authors at least that same number of times.
Company Filing History:
1. Shin-etsu Chemical Co., Ltd. (78 from 5,966 patents)
2. International Business Machines Corporation (2 from 164,108 patents)
3. Matsushita Electric Industrial Co., Ltd. (2 from 27,375 patents)
4. Nippon Telegraph and Telephone Corporation (2 from 5,289 patents)
5. Shin-estu Chemical Co., Ltd. (2 from 24 patents)
6. Nippon Telegraph & Telephone Co. (1 from 16 patents)
81 patents:
1. 12197127 - Negative photosensitive resin composition, patterning process, method for forming cured film, interlayer insulation film, surface protective film, and electronic component
2. 12195568 - Positive photosensitive resin composition, positive photosensitive dry film, method for producing positive photosensitive dry film, patterning process, method for forming cured film, interlayer insulation film, surface protective film, and electronic component
3. 12085856 - Positive photosensitive resin composition, positive photosensitive dry film, method for producing positive photosensitive dry film, patterning process, method for forming cured film, interlayer insulation film, surface protective film, and electronic component
4. 11892773 - Photosensitive resin composition, patterning process, method for forming cured film, interlayer insulation film, surface protective film, and electronic component
5. 11768434 - Polymer having a structure of polyamide, polyamide-imide, or polyimide, photosensitive resin composition, patterning process, photosensitive dry film, and protective film for electric and electronic parts
6. 11572442 - Compound, polyimide resin and method of producing the same, photosensitive resin composition, patterning method and method of forming cured film, interlayer insulating film, surface protective film, and electronic component
7. 11333975 - Polymer, photosensitive resin composition, patterning method, method of forming cured film, interlayer insulating film, surface protective film, and electronic component
8. 11150556 - Polymer of polyimide precursor, positive type photosensitive resin composition, negative type photosensitive resin composition, patterning process, method for forming cured film, interlayer insulating film, surface protective film, and electronic parts
9. 10919918 - Tetracarboxylic dianhydride, polyimide resin and method for producing the same, photosensitive resin compositions, patterning process, method for forming cured film, interlayer insulating film, surface protective film, and electronic parts
10. 10815572 - Chemically amplified positive resist composition and pattern forming process
11. 10816900 - Tetracarboxylic acid diester compound, polymer of polyimide precursor and method for producing same, negative photosensitive resin composition, patterning process, and method for forming cured film
12. 10457779 - Tetracarboxylic acid diester compound, polyimide precursor polymer and method for producing the same, negative photosensitive resin composition, positive photosensitive resin composition, patterning process, and method for forming cured film
13. 10319653 - Semiconductor apparatus, stacked semiconductor apparatus, encapsulated stacked-semiconductor apparatus, and method for manufacturing the same
14. 10216085 - Tetracarboxylic acid diester compound, polyimide precursor polymer and method for producing the same, negative photosensitive resin composition, patterning process, and method for forming cured film
15. 10203601 - Tetracarboxylic acid diester compound, polymer of polyimide precursor and method for producing same, negative photosensitive resin composition, patterning process, and method for forming cured film