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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 11768434 B1

PDFFull Text
Date of Patent:
Sep. 26, 2023

Filed:

Jul. 16, 2019

Polymer having a structure of polyamide, polyamide-imide, or polyimide, photosensitive resin composition, patterning process, photosensitive dry film, and protective film for electric and electronic parts

Applicant:

Shin-etsu Chemical Co., Ltd., Tokyo, JP;

Inventors:

Katsuya Takemura, Joetsu, JP;

Masashi Iio, Joetsu, JP;

Hiroyuki Urano, Joetsu, JP;

Kazuya Honda, Joetsu, JP;

Assignee:

SHIN-ETSU CHEMICAL CO., LTD., Tokyo, JP;

Attorney:

Oliff PLC

Primary Examiner:

John S Chu

Int. Cl.
CPC ...
G03F 7/023 (2006.01); G03F 7/40 (2006.01); C08G 73/10 (2006.01); C08G 73/14 (2006.01); C08G 73/22 (2006.01); C08G 69/26 (2006.01); G03F 7/004 (2006.01); G03F 7/039 (2006.01); G03F 7/038 (2006.01); G03F 7/16 (2006.01); G03F 7/20 (2006.01); G03F 7/32 (2006.01);
U.S. Cl.
CPC ...
G03F 7/0233 (2013.01); C08G 69/26 (2013.01); C08G 73/1039 (2013.01); C08G 73/1042 (2013.01); C08G 73/1053 (2013.01); C08G 73/1071 (2013.01); C08G 73/14 (2013.01); C08G 73/22 (2013.01); G03F 7/0045 (2013.01); G03F 7/0382 (2013.01); G03F 7/0392 (2013.01); G03F 7/162 (2013.01); G03F 7/168 (2013.01); G03F 7/2004 (2013.01); G03F 7/2037 (2013.01); G03F 7/322 (2013.01); G03F 7/40 (2013.01);
Abstract

The present invention is a polymer having a polyamide structural unit, a polyamide-imide structural unit, or a polyimide structural unit, selected from a polyamide, a polyamide-imide, a polyimide, a polyimide precursor, a polybenzoxazole, and a polybenzoxazole precursor, including a reaction product of a diamine containing at least one of a diamine shown by the following general formula (1) and a diamine shown by the following general formula (2), together with at least one of a tetracarboxylic dianhydride shown by the following general formula (3) as well as a dicarboxylic acid and a dicarboxylic halide shown by the following general formula (4). This provides a polymer which is soluble in a safe organic solvent used widely, and is usable as a base resin of a positive photosensitive resin composition that is soluble in an aqueous alkaline solution and capable of forming a fine pattern to give higher resolution.

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