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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10457779 B1

PDFFull Text
Date of Patent:
Oct. 29, 2019

Filed:

Mar. 13, 2017

Tetracarboxylic acid diester compound, polyimide precursor polymer and method for producing the same, negative photosensitive resin composition, positive photosensitive resin composition, patterning process, and method for forming cured film

Applicant:

Shin-etsu Chemical Co., Ltd., Tokyo, JP;

Inventors:

Katsuya Takemura, Jyoetsu, JP;

Hiroyuki Urano, Jyoetsu, JP;

Masashi Iio, Jyoetsu, JP;

Masayoshi Sagehashi, Jyoetsu, JP;

Koji Hasegawa, Jyoetsu, JP;

Assignee:

SHIN-ETSU CHEMICAL CO., LTD., Tokyo, JP;

Attorney:

Oliff PLC

Primary Examiner:

John S Chu

Int. Cl.
CPC ...
G03F 7/023 (2006.01); G03F 7/031 (2006.01); G03F 7/037 (2006.01); G03F 7/038 (2006.01); G03F 7/38 (2006.01); G03F 7/40 (2006.01); C08G 73/10 (2006.01); C08G 73/12 (2006.01); C07C 69/76 (2006.01); C07C 69/88 (2006.01); G03F 7/022 (2006.01); C07C 69/92 (2006.01); G03F 7/004 (2006.01); G03F 7/039 (2006.01); G03F 7/16 (2006.01); G03F 7/20 (2006.01); G03F 7/32 (2006.01); C09D 179/08 (2006.01);
U.S. Cl.
CPC ...
C08G 73/1039 (2013.01); C07C 69/76 (2013.01); C07C 69/92 (2013.01); C08G 73/105 (2013.01); C08G 73/106 (2013.01); C08G 73/1007 (2013.01); C08G 73/1042 (2013.01); C08G 73/1071 (2013.01); C08G 73/123 (2013.01); C08G 73/126 (2013.01); C09D 179/08 (2013.01); G03F 7/0045 (2013.01); G03F 7/0046 (2013.01); G03F 7/0226 (2013.01); G03F 7/0233 (2013.01); G03F 7/031 (2013.01); G03F 7/037 (2013.01); G03F 7/038 (2013.01); G03F 7/039 (2013.01); G03F 7/0387 (2013.01); G03F 7/0388 (2013.01); G03F 7/162 (2013.01); G03F 7/168 (2013.01); G03F 7/2037 (2013.01); G03F 7/322 (2013.01); G03F 7/38 (2013.01); G03F 7/40 (2013.01);
Abstract

The present invention provides a tetracarboxylic acid diester compound shown by the following general formula (1), wherein Xrepresents a tetravalent organic group; and Rrepresents a group shown by the following general formula (2), wherein the dotted line represents a bond; Yrepresents an organic group with a valency of k+1; 'k' represents 1 or 2; and 'n' represents 0 or 1. There can be provided a tetracarboxylic acid diester compound that can give a polyimide precursor polymer soluble in a safe organic solvent widely used as a solvent of a composition and usable as a base resin of a photosensitive resin composition.

Find Patent Forward Citations

Takemura, Katsuya. (2019). Tetracarboxylic acid diester compound, polyimide precursor polymer and method for producing the same, negative photosensitive resin composition, positive photosensitive resin composition, patterning process, and method for forming cured film (U.S. Patent No. 10457779). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/10457779

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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