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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 11333975 B1

PDFFull Text
Date of Patent:
May. 17, 2022

Filed:

Apr. 14, 2020

Polymer, photosensitive resin composition, patterning method, method of forming cured film, interlayer insulating film, surface protective film, and electronic component

Applicants:

International Business Machines Corporation, Armonk, NY (US);

Shin-etsu Chemical Co., Ltd., Tokyo, JP;

Inventors:

Dmitry Zubarev, San Jose, CA (US);

Hiroyuki Urano, Joetsu, JP;

Katsuya Takemura, Joetsu, JP;

Masashi Iio, Joetsu, JP;

Kazuya Honda, Yokohama, JP;

Yoshio Kawai, Kawasaki, JP;

Assignees:

International Business Machines Corporation, Armonk, NY (US);

Shin-Etsu Chemical Co., Ltd., Tokyo, JP;

Attorneys:

Karen Canaan

CanaanLaw, P.C.

Primary Examiner:

John S Chu

Int. Cl.
CPC ...
G03F 7/023 (2006.01); C08G 73/10 (2006.01); C08G 73/14 (2006.01); C08G 73/22 (2006.01); G03F 7/022 (2006.01); G03F 7/038 (2006.01); G03F 7/039 (2006.01); G03F 7/16 (2006.01); G03F 7/20 (2006.01); G03F 7/32 (2006.01); G03F 7/40 (2006.01);
U.S. Cl.
CPC ...
G03F 7/0226 (2013.01); C08G 73/1067 (2013.01); C08G 73/22 (2013.01); G03F 7/022 (2013.01); G03F 7/0233 (2013.01); G03F 7/039 (2013.01); G03F 7/0387 (2013.01); G03F 7/162 (2013.01); G03F 7/20 (2013.01); G03F 7/322 (2013.01); G03F 7/40 (2013.01);
Abstract

Provided is a polymer that can be used as a base resin for a positive photosensitive resin composition and a negative photosensitive resin composition, wherein the positive photosensitive resin composition and the negative photosensitive resin composition are soluble in an aqueous alkaline solution, can form a fine pattern, can achieve high resolution, and have good mechanical properties even when they are cured at low temperature. Also provided are a positive photosensitive resin composition and a negative photosensitive resin composition using the polymer. The polymer is represented by general formulas (1) and/or (2): wherein Tand Tmay be the same as, or different from, each other and represent any of —CO— and —SO—; Xis a tetravalent organic group; and l is 0 or 1; and Xis a divalent organic group.

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