Hsien-Liang Meng

USPTO Granted Patents = 16 (Patent Applications = 1)

Average Co-Inventor Count = 4.4

ph-index = 4

Forward Citations = 40(Granted Patents)

Location History:

Tainan, TW (2015)
Hsinchu, TW (2000 - 2021)

Company Filing History:

10 out of 40,635

Taiwan Semiconductor Manufacturing Comp. Ltd.

patents

3 out of 7,074

United Microelectronics Corp.

patents

3 out of 54

United Silicon Incorporated

patents

Years Active: 2000-2021

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16 patents (USPTO):Sort by Forward CitationsExplore Patents

1. 11211261 - Package structures and methods for forming the same (2021-12-28),

2. 11088109 - Packages with multi-thermal interface materials and methods of fabricating the same (2021-08-10),

3. 10872831 - Method of forming a semiconductor package (2020-12-22),

4. 10269669 - Semiconductor package and method of forming the same (2019-04-23),

5. 10049894 - Package structures and methods for forming the same (2018-08-14),

6. 9418956 - Zero stand-off bonding system and method (2016-08-16),

7. 9362236 - Package structures and methods for forming the same (2016-06-07),

8. 9129878 - Mechanisms for forming backside illuminated image sensor device structure (2015-09-08),

9. 9127356 - Sputtering target with reverse erosion profile surface and sputtering system and method using the same (2015-09-08),

10. 9064880 - Zero stand-off bonding system and method (2015-06-23),

11. 7402496 - Complementary metal-oxide-semiconductor device and fabricating method thereof (2008-07-22),

12. 7288828 - Metal oxide semiconductor transistor device (2007-10-30),

13. 6225189 - Method of fabricating shallow trench isolation structure (2001-05-01),

14. 6204147 - Method of manufacturing shallow trench isolation (2001-03-20),

15. 6187692 - Method for forming an insulating film (2001-02-13),

Title: Hsien-Liang Meng: Innovator from Hsinchu

Introduction: Hsien-Liang Meng is a renowned inventor hailing from Hsinchu, Taiwan, known for his groundbreaking contributions to the field of technology and innovation.

Latest Patents: Hsien-Liang Meng holds several patents in the areas of semiconductor technology, renewable energy, and advanced materials, showcasing his diverse range of expertise and innovative spirit.

Career Highlights: With a career spanning over two decades, Meng has worked with leading tech companies and research institutions, playing a pivotal role in developing cutting-edge technologies that have revolutionized various industries.

Collaborations: Throughout his career, Hsien-Liang Meng has collaborated with top researchers, engineers, and scientists from around the world, fostering a culture of innovation and knowledge exchange that has led to numerous breakthroughs.

Conclusion: Hsien-Liang Meng's passion for innovation, coupled with his relentless pursuit of excellence, has solidified his reputation as a visionary inventor and a driving force behind the advancement of technology on a global scale.

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1 patent pending:

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