The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 22, 2020
Filed:
Apr. 22, 2019
Taiwan Semiconductor Manufacturing Co., Ltd., Hsinchu, TW;
Ying-Shin Han, Hsinchu, TW;
Yen-Miao Lin, Miaoli County, TW;
Chung-Chih Chen, Hsinchu, TW;
Hsien-Liang Meng, Hsinchu, TW;
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD., Hsinchu, TW;
Abstract
A method of forming a semiconductor package includes dispensing an adhesive on a substrate that has an integrated circuit die attached thereon, placing a lid over the integrated circuit die such that a bottom surface of the lid caps at least a portion of the adhesive, and pressing the lid against the substrate such that a portion of the adhesive is squeezed from a space between the bottom surface of the lid and the substrate onto a sidewall of the lid.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile