Ying-Shin Han

Title: Innovations by Ying-Shin Han

Introduction

Ying-Shin Han is a prominent inventor based in Hsinchu, Taiwan. He has made significant contributions to the field of semiconductor technology, holding a total of 4 patents. His work focuses on methods and devices that enhance the efficiency and functionality of semiconductor packages.

Latest Patents

One of his latest patents is a method of forming a semiconductor package. This method involves dispensing an adhesive on a substrate that has an integrated circuit die attached. A lid is then placed over the integrated circuit die, ensuring that a bottom surface of the lid caps at least a portion of the adhesive. The lid is pressed against the substrate, causing a portion of the adhesive to be squeezed from the space between the lid and the substrate onto a sidewall of the lid. Another notable patent is for a semiconductor device that includes an electronic component, a package, a substrate, and a plurality of first and second conductors. The package is positioned over the electronic component, with the substrate situated between them. The design allows for effective electrical connections between the electronic component and the substrate.

Career Highlights

Ying-Shin Han is currently employed at Taiwan Semiconductor Manufacturing Company Ltd., a leading firm in the semiconductor industry. His innovative work has contributed to advancements in semiconductor packaging and device design, making him a valuable asset to his company.

Collaborations

He has collaborated with notable coworkers, including Yen-Miao Lin and Chung-Chih Chen, who have also contributed to the field of semiconductor technology.

Conclusion

Ying-Shin Han's contributions to semiconductor technology through his patents and work at Taiwan Semiconductor Manufacturing Company Ltd. highlight his role as an influential inventor in the industry. His innovative methods and devices continue to shape the future of semiconductor applications.