The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 02, 2019
Filed:
Aug. 28, 2017
Taiwan Semiconductor Manufacturing Company Ltd., Hsinchu, TW;
Kuan-Yu Huang, Taipei, TW;
Tzu-Kai Lan, Yilan County, TW;
Shou-Chih Yin, Taipei, TW;
Shu-Chia Hsu, Hsinchu, TW;
Pai-Yuan Li, Taichun, TW;
Sung-Hui Huang, Yilan County, TW;
Hsiang-Fan Lee, Hsinchu, TW;
Ying-Shin Han, Hsinchu, TW;
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD., Hsinchu, TW;
Abstract
A semiconductor device includes a substrate, a package, first conductors and second conductors. The substrate includes a first surface and a second surface opposite to the first surface. The package is disposed over the substrate. The first conductors are disposed over the substrate. The second conductors are disposed over the substrate, wherein the first conductors and the second conductors are substantially at a same tier, and a width of the second conductor is larger than a width of the first conductor.