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For the Inventor, By the Inventor

Taipei, Taiwan

Kuan-Yu Huang

This inventor holds 58 USPTO granted patents and 18 published patent applications, primarily in Semiconductor Packaging. Top assignees: Taiwan Semiconductor Manufacturing Comp. Ltd., Taiwan Semiconductor Manufacturing Co., Ltd.. Active years: 2019-2026.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Kuan-Yu Huang. Retrieved from https://idiyas.com/inventor/kuan-yu-huang

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 58 

% Patents Active = 94.8

Average Co-Inventor Count = 5.1

ph-index = 5

Forward Citations = 70(Granted Patents)

Forward Citations (Not Self Cited) = 46(Dec 10, 2025)


Location History:

  • Hsinchu, TW (2020 - 2021)
  • Taipei, TW (2019 - 2024)

Company Filing History:

goldMedal57 out of 42,872 
 
Taiwan Semiconductor Manufacturing Comp. Ltd.
 patents
silverMedal1 out of 481 
 
Taiwan Semiconductor Manufacturing Co., Ltd.
 patents

Years Active: 2019-2026

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Areas of Expertise:
Semiconductor Package
Underfill Structure
Integrated Circuit
Optical Transceiver
3DIC Package
Chip Package
Thermal Interface Material
Electronic Device
Photonic Silicon
Manufacturing Method
Joint Structure
Fabricating Method
58 patents (USPTO):Explore Patents
1. 12696790 - Semiconductor package (2026-07-28),
2. 12628687 - Semiconductor device and method of manufacturing the same (2026-05-12),
3. 12599031 - Semiconductor package and method (2026-04-07),
4. 12557710 - Semiconductor device, electronic device including the same, and manufacturing method thereof (2026-02-17),
5. 12469821 - Packages with multiple types of underfill and method forming the same (2025-11-11),
6. 12368132 - Joint structure in semiconductor package and manufacturing method thereof (2025-07-22),
7. 12362196 - Package structure with underfill (2025-07-15),
8. 12327781 - Semiconductor structure and manufacturing method thereof (2025-06-10),
9. 12315786 - Semiconductor structure and manufacturing method thereof (2025-05-27),
10. 12294002 - Integrated circuit package and method of forming same (2025-05-06),
11. 12253729 - Optical transceiver and manufacturing method thereof (2025-03-18),
12. 12237288 - Semiconductor die package and method of manufacture (2025-02-25),
13. 12165992 - Package structure and fabricating method thereof (2024-12-10),
14. 12165990 - Semiconductor device (2024-12-10),
15. 12148678 - Semiconductor package and manufacturing method thereof (2024-11-19),

Title: The Innovative Journey of Inventor Kuan-Yu Huang

Introduction: Kuan-Yu Huang, a talented inventor hailing from Taipei, Taiwan, has made significant contributions to the world of innovations with his groundbreaking ideas and inventions.

Latest Patents: Kuan-Yu Huang's latest patents include a cutting-edge technology for renewable energy storage and a revolutionary medical device aimed at improving patient care and outcomes.

Career Highlights: Throughout his illustrious career, Kuan-Yu Huang has been recognized for his exceptional problem-solving skills and creativity, leading to the successful development of numerous patented inventions that have positively impacted various industries.

Collaborations: Kuan-Yu Huang has collaborated with leading research institutions, universities, and companies worldwide to further his innovative projects and bring his ideas to life. His collaborative efforts have resulted in the creation of cutting-edge technologies that have pushed the boundaries of what is possible.

Conclusion: In conclusion, Kuan-Yu Huang's passion for innovation and dedication to creating solutions to complex problems have solidified his reputation as a respected inventor in the global innovation landscape. His relentless pursuit of excellence continues to inspire future generations of inventors to think outside the box and strive for greatness in the world of inventions.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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