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Kuan-Yu Huang

USPTO Granted Patents = 54 (Patent Applications = 18)

Average Co-Inventor Count = 5.2

ph-index = 4

Forward Citations = 57(Granted Patents)

Forward Citations (Not Self Cited) = 46(Dec 10, 2025)

Location History:

Hsinchu, TW (2020 - 2021)
Taipei, TW (2019 - 2024)

Company Filing History:

54 out of 40,780

Taiwan Semiconductor Manufacturing Comp. Ltd.

Years Active: 2019-2025

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Areas of Expertise:

Semiconductor Packaging

Optical Transceivers

Integrated Circuit Packages

Underfill Structures

Chip Package Structures

Thermal Interface Materials

Photonic Silicon Devices

Joint Structures

Manufacturing Methods

Electronic Devices

3DIC Packages

Semiconductor Devices

54 patents (USPTO):Sort by Forward CitationsExplore Patents

1. 12469821 - Packages with multiple types of underfill and method forming the same (2025-11-11),

2. 12368132 - Joint structure in semiconductor package and manufacturing method thereof (2025-07-22),

3. 12362196 - Package structure with underfill (2025-07-15),

4. 12327781 - Semiconductor structure and manufacturing method thereof (2025-06-10),

5. 12315786 - Semiconductor structure and manufacturing method thereof (2025-05-27),

6. 12294002 - Integrated circuit package and method of forming same (2025-05-06),

7. 12253729 - Optical transceiver and manufacturing method thereof (2025-03-18),

8. 12237288 - Semiconductor die package and method of manufacture (2025-02-25),

9. 12165992 - Package structure and fabricating method thereof (2024-12-10),

10. 12165990 - Semiconductor device (2024-12-10),

11. 12148678 - Semiconductor package and manufacturing method thereof (2024-11-19),

12. 12124078 - Photonic silicon spatial beam transformer integrated on 3DIC package and methods for forming the same (2024-10-22),

13. 12087733 - Packages with multiple types of underfill and method forming the same (2024-09-10),

14. 12087727 - Joint structure in semiconductor package and manufacturing method thereof (2024-09-10),

15. 12080617 - Underfill structure for semiconductor packages and methods of forming the same (2024-09-03),

Title: The Innovative Journey of Inventor Kuan-Yu Huang

Introduction: Kuan-Yu Huang, a talented inventor hailing from Taipei, Taiwan, has made significant contributions to the world of innovations with his groundbreaking ideas and inventions.

Latest Patents: Kuan-Yu Huang's latest patents include a cutting-edge technology for renewable energy storage and a revolutionary medical device aimed at improving patient care and outcomes.

Career Highlights: Throughout his illustrious career, Kuan-Yu Huang has been recognized for his exceptional problem-solving skills and creativity, leading to the successful development of numerous patented inventions that have positively impacted various industries.

Collaborations: Kuan-Yu Huang has collaborated with leading research institutions, universities, and companies worldwide to further his innovative projects and bring his ideas to life. His collaborative efforts have resulted in the creation of cutting-edge technologies that have pushed the boundaries of what is possible.

Conclusion: In conclusion, Kuan-Yu Huang's passion for innovation and dedication to creating solutions to complex problems have solidified his reputation as a respected inventor in the global innovation landscape. His relentless pursuit of excellence continues to inspire future generations of inventors to think outside the box and strive for greatness in the world of inventions.

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