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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 12557710 B1

PDFFull Text
Date of Patent:
Feb. 17, 2026

Filed:

Jul. 26, 2022

Semiconductor device, electronic device including the same, and manufacturing method thereof

Applicant:

Taiwan Semiconductor Manufacturing Company, Ltd., Hsinchu, TW;

Inventors:

Kuan-Yu Huang, Taipei, TW;

Sung-Hui Huang, Yilan County, TW;

Shang-Yun Hou, Hsinchu, TW;

Assignee:

Taiwan Semiconductor Manufacturing Company, Ltd., Hsinchu, TW;

Attorney:

JCIPRNET

Primary Examiner:

Marcos D Pizarro

Int. Cl.
CPC ...
H01L 23/498 (2006.01); H01L 21/48 (2006.01); H01L 23/00 (2006.01); H01L 23/04 (2006.01); H01L 23/053 (2006.01); H01L 23/31 (2006.01); H01L 23/538 (2006.01);
U.S. Cl.
CPC ...
H01L 23/49816 (2013.01); H01L 21/4853 (2013.01); H01L 23/04 (2013.01); H01L 23/041 (2013.01); H01L 23/053 (2013.01); H01L 23/3128 (2013.01); H01L 23/498 (2013.01); H01L 23/49811 (2013.01); H01L 23/49827 (2013.01); H01L 23/538 (2013.01); H01L 23/5383 (2013.01); H01L 23/5384 (2013.01); H01L 23/562 (2013.01);
Abstract

A semiconductor device includes a circuit substrate, a semiconductor package, connective terminals and supports. The circuit substrate has a first side and a second side opposite to the first side. The semiconductor package is connected to the first side of the circuit substrate. The connective terminals are located on the second side of the circuit substrate and are electrically connected to the semiconductor package via the circuit substrate. The supports are located on the second side of the circuit substrate beside the connective terminals. A material of the supports has a melting temperature higher than a melting temperature of the connective terminals.

Find Patent Forward Citations

Huang, Kuan-Yu. (2026). Semiconductor device, electronic device including the same, and manufacturing method thereof (U.S. Patent No. 12557710). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12557710

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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