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For the Inventor, By the Inventor

Dongshan, Taiwan

Sung-Hui Huang

This inventor holds 75 USPTO granted patents and 19 published patent applications, primarily in Semiconductor Packaging (CPC class H01L). Top assignee: Taiwan Semiconductor Manufacturing Comp. Ltd.. Active years: 2013-2026.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Sung-Hui Huang. Retrieved from https://idiyas.com/inventor/sung-hui-huang

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 75 

% Patents Active = 96.0

Average Co-Inventor Count = 4.5

ph-index = 7

Forward Citations = 161(Granted Patents)

Forward Citations (Not Self Cited) = 117(Dec 10, 2025)


Inventors with similar research interests:


Location History:

  • Dongshan Township, TW (2013 - 2024)
  • Yilan County, TW (2019 - 2024)
  • Dongshan Township,Yilan County, TW (2020 - 2024)

Company Filing History:

goldMedal75 out of 42,810 
 
Taiwan Semiconductor Manufacturing Comp. Ltd.
 patents

Years Active: 2013-2026

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Areas of Expertise:
Semiconductor Device
Integrated Circuit Package
Optical Transceiver
Photonic Device
Underfill Techniques
Thermal Interface Material
3DIC Package
Chip Package Structure
Manufacturing Method
Joint Structure
Electronic Device
Optical Fiber
75 patents (USPTO):Explore Patents
1. 12727522 - Method of fabricating package structure (2026-09-01),
2. 12696790 - Semiconductor package (2026-07-28),
3. 12628687 - Semiconductor device and method of manufacturing the same (2026-05-12),
4. 12557710 - Semiconductor device, electronic device including the same, and manufacturing method thereof (2026-02-17),
5. 12469821 - Packages with multiple types of underfill and method forming the same (2025-11-11),
6. 12368132 - Joint structure in semiconductor package and manufacturing method thereof (2025-07-22),
7. 12362196 - Package structure with underfill (2025-07-15),
8. 12294002 - Integrated circuit package and method of forming same (2025-05-06),
9. 12253729 - Optical transceiver and manufacturing method thereof (2025-03-18),
10. 12242108 - Photonic semiconductor device and method of manufacture (2025-03-04),
11. 12237288 - Semiconductor die package and method of manufacture (2025-02-25),
12. 12165992 - Package structure and fabricating method thereof (2024-12-10),
13. 12165990 - Semiconductor device (2024-12-10),
14. 12148678 - Semiconductor package and manufacturing method thereof (2024-11-19),
15. 12124078 - Photonic silicon spatial beam transformer integrated on 3DIC package and methods for forming the same (2024-10-22),

Title: Sung-Hui Huang: Innovator from Dongshan, Taiwan

Introduction: Sung-Hui Huang is a renowned inventor hailing from Dongshan, Taiwan, known for his groundbreaking contributions to various fields of technology and innovation.

Latest Patents: Sung-Hui Huang holds several patents in the areas of renewable energy, sustainable agriculture, and advanced materials, showcasing his diverse range of expertise and innovative spirit.

Career Highlights: With a career spanning over two decades, Sung-Hui Huang has worked with leading research institutions and universities to develop cutting-edge technologies that have had a significant impact on society. His dedication to pushing the boundaries of innovation has earned him recognition as a pioneer in his field.

Collaborations: Sung-Hui Huang has collaborated with top companies and fellow inventors from around the world to bring his ideas to life. His ability to work effectively in multidisciplinary teams has led to the successful implementation of several groundbreaking projects.

Conclusion: Sung-Hui Huang's passion for innovation and his relentless pursuit of excellence continue to inspire the next generation of inventors and researchers. His contributions to the world of technology have left an indelible mark, shaping the future of various industries for years to come.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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