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For the Inventor, By the Inventor

Dongshan, Taiwan

Sung-Hui Huang

USPTO Granted Patents = 71 

Average Co-Inventor Count = 4.6

ph-index = 6

Forward Citations = 132(Granted Patents)

Forward Citations (Not Self Cited) = 117(Dec 10, 2025)


Inventors with similar research interests:


Location History:

  • Dongshan Township, TW (2013 - 2024)
  • Yilan County, TW (2019 - 2024)
  • Dongshan Township,Yilan County, TW (2020 - 2024)

Company Filing History:

goldMedal71 out of 40,674 
 
Taiwan Semiconductor Manufacturing Comp. Ltd.
 patents

Years Active: 2013-2025

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Areas of Expertise:
Semiconductor Packaging
Integrated Circuit Package
Photonic Semiconductor Device
Optical Transceiver
Chip Package Structure
Thermal Interface Material
Joint Structure
Underfill Technology
3DIC Package
Optical Fiber Packaging
Conductive Vias
Semiconductor Manufacturing
71 patents (USPTO):Explore Patents
1. 12469821 - Packages with multiple types of underfill and method forming the same (2025-11-11),
2. 12368132 - Joint structure in semiconductor package and manufacturing method thereof (2025-07-22),
3. 12362196 - Package structure with underfill (2025-07-15),
4. 12294002 - Integrated circuit package and method of forming same (2025-05-06),
5. 12253729 - Optical transceiver and manufacturing method thereof (2025-03-18),
6. 12242108 - Photonic semiconductor device and method of manufacture (2025-03-04),
7. 12237288 - Semiconductor die package and method of manufacture (2025-02-25),
8. 12165992 - Package structure and fabricating method thereof (2024-12-10),
9. 12165990 - Semiconductor device (2024-12-10),
10. 12148678 - Semiconductor package and manufacturing method thereof (2024-11-19),
11. 12124078 - Photonic silicon spatial beam transformer integrated on 3DIC package and methods for forming the same (2024-10-22),
12. 12087733 - Packages with multiple types of underfill and method forming the same (2024-09-10),
13. 12087727 - Joint structure in semiconductor package and manufacturing method thereof (2024-09-10),
14. 12080681 - Package structure and method of fabricating the same (2024-09-03),
15. 12051668 - Semiconductor package and method of forming the same (2024-07-30),

Title: Sung-Hui Huang: Innovator from Dongshan, Taiwan

Introduction: Sung-Hui Huang is a renowned inventor hailing from Dongshan, Taiwan, known for his groundbreaking contributions to various fields of technology and innovation.

Latest Patents: Sung-Hui Huang holds several patents in the areas of renewable energy, sustainable agriculture, and advanced materials, showcasing his diverse range of expertise and innovative spirit.

Career Highlights: With a career spanning over two decades, Sung-Hui Huang has worked with leading research institutions and universities to develop cutting-edge technologies that have had a significant impact on society. His dedication to pushing the boundaries of innovation has earned him recognition as a pioneer in his field.

Collaborations: Sung-Hui Huang has collaborated with top companies and fellow inventors from around the world to bring his ideas to life. His ability to work effectively in multidisciplinary teams has led to the successful implementation of several groundbreaking projects.

Conclusion: Sung-Hui Huang's passion for innovation and his relentless pursuit of excellence continue to inspire the next generation of inventors and researchers. His contributions to the world of technology have left an indelible mark, shaping the future of various industries for years to come.

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