The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 20, 2026
Filed:
Jan. 05, 2023
Taiwan Semiconductor Manufacturing Co., Ltd., Hsinchu, TW;
Wen-Wei Shen, Hsinchu, TW;
Sung-Hui Huang, Dongshan Township, TW;
Shang-Yun Hou, Jubei City, TW;
Sen-Bor Jan, Tainan City, TW;
Szu-PO Huang, Taichung City, TW;
Kuan-Yu Huang, Taipei, TW;
Taiwan Semiconductor Manufacturing Co., Ltd., Hsinchu, TW;
Abstract
A semiconductor device includes: a substrate; a plurality of dies attached to a first side of the substrate; a molding material on the first side of the substrate around the plurality of dies; a first redistribution structure on a second side of the substrate opposing the first side, where the first redistribution structure includes dielectric layers and conductive features in the dielectric layers, where the conductive features include conductive lines, vias, and dummy metal patterns isolated from the conductive lines and the vias; and conductive connectors attached to a first surface of the first redistribution structure facing away from the substrate.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile