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For the Inventor, By the Inventor

Xinzhuang, Taiwan

Wen-Wei Shen

This inventor holds 17 USPTO granted patents and 3 published patent applications, primarily in Semiconductor Packaging. Top assignees: Taiwan Semiconductor Manufacturing Comp. Ltd., Industrial Technology Research Institute. Active years: 2011-2026.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Wen-Wei Shen. Retrieved from https://idiyas.com/inventor/wen-wei-shen

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank
USPTO Granted Patents = 17 

% Patents Active = 94.1

Average Co-Inventor Count = 4.0

ph-index = 6

Forward Citations = 113(Granted Patents)


Location History:

  • Xinzhuang, TW (2011 - 2017)
  • Hsinchu, TW (2016 - 2024)

Company Filing History:

goldMedal16 out of 43,553 
 
Taiwan Semiconductor Manufacturing Comp. Ltd.
 patents
silverMedal1 out of 9,318 
 
Industrial Technology Research Institute
 patents

Years Active: 2011-2026

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Areas of Expertise:
Semiconductor Package
Micro-Bump Joints
Through Silicon Via
Substrate Interconnections
Zigzag Pattern
Recessed Pillar Structure
Stacking Structure
Interconnection Geometry
Dummy Structure
Fabrication Method
17 patents (USPTO):Explore Patents
1. 12772902 - Semiconductor package having dummy metal patterns (2026-10-20),
2. 12727522 - Method of fabricating package structure (2026-09-01),
3. 12148678 - Semiconductor package and manufacturing method thereof (2024-11-19),
4. 12080681 - Package structure and method of fabricating the same (2024-09-03),
5. 11502015 - Semiconductor package and manufacturing method thereof (2022-11-15),
6. 11424219 - Package structure and method of fabricating the same (2022-08-23),
7. 9773755 - Substrate interconnections having different sizes (2017-09-26),
8. 9768138 - Improving the strength of micro-bump joints (2017-09-19),
9. 9373564 - Semiconductor device, manufacturing method and stacking structure thereof (2016-06-21),
10. 9219046 - Strength of micro-bump joints (2015-12-22),
11. 9142533 - Substrate interconnections having different sizes (2015-09-22),
12. 8901736 - Strength of micro-bump joints (2014-12-02),
13. 8653648 - Zigzag pattern for TSV copper adhesion (2014-02-18),
14. 8241963 - Recessed pillar structure (2012-08-14),
15. 8202800 - Method of forming through silicon via with dummy structure (2012-06-19),

Title: Inventor Wen-Wei Shen: Revolutionizing Technology in Xinzhuang

Introduction: Wen-Wei Shen is a pioneering inventor based in Xinzhuang, Taiwan, known for her groundbreaking contributions to the field of technology and innovation.

Latest Patents: Shen's latest patents focus on advancements in artificial intelligence algorithms for autonomous vehicles, wearable technology for healthcare monitoring, and sustainable energy solutions for urban environments.

Career Highlights: With a career spanning over two decades, Shen has worked with leading tech companies in Taiwan, spearheading research and development projects that have resulted in numerous successful patent applications.

Collaborations: Shen has collaborated with top research institutions and universities in Taiwan, fostering a culture of innovation and knowledge-sharing within the tech community. Her partnerships have led to the development of cutting-edge technologies with real-world applications.

Conclusion: Wen-Wei Shen's dedication to pushing the boundaries of technology and her commitment to innovation make her a standout figure in the world of inventors. Her work continues to inspire future generations of inventors and researchers in Xinzhuang and beyond.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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