The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 02, 2014
Filed:
May. 28, 2010
Applicants:
Wen-wei Shen, Xinzhuang, TW;
Chen-shien Chen, Zhubei, TW;
Chen-cheng Kuo, Chu-Pei, TW;
Ming-fa Chen, Taichung, TW;
Rung-de Wang, Kaohsiung, TW;
Inventors:
Wen-Wei Shen, Xinzhuang, TW;
Chen-Shien Chen, Zhubei, TW;
Chen-Cheng Kuo, Chu-Pei, TW;
Ming-Fa Chen, Taichung, TW;
Rung-De Wang, Kaohsiung, TW;
Assignee:
Taiwan Semiconductor Manufacturing Company, Ltd., Hsin-Chu, TW;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/48 (2006.01); H01L 23/31 (2006.01); H01L 25/065 (2006.01);
U.S. Cl.
CPC ...
H01L 23/3157 (2013.01); H01L 2224/16148 (2013.01); H01L 2924/01322 (2013.01); H01L 2225/06541 (2013.01); H01L 2224/16238 (2013.01); H01L 2924/10253 (2013.01); H01L 2224/13019 (2013.01); H01L 25/0657 (2013.01); H01L 2225/06513 (2013.01); H01L 2224/81193 (2013.01); H01L 2924/14 (2013.01); H01L 2224/1146 (2013.01);
Abstract
A device includes a work piece including a metal bump; and a dielectric layer having a portion directly over the metal bump. The metal bump and a surface of the portion of the dielectric layer form an interface. A metal finish is formed over and contacting the metal bump. The metal finish extends from over the dielectric layer to below the interface.