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For the Inventor, By the Inventor

Kaohsiung, Taiwan

Rung-De Wang

USPTO Granted Patents = 9 

Average Co-Inventor Count = 5.9

ph-index = 4

Forward Citations = 32(Granted Patents)


Company Filing History:

goldMedal9 out of 40,780 
 
Taiwan Semiconductor Manufacturing Comp. Ltd.
 patents

Years Active: 2014-2025

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9 patents (USPTO):Explore Patents
1. 12230593 - Wafer level package with polymer layer delamination prevention design and method of forming the same (2025-02-18),
2. 11855007 - Semiconductor structure (2023-12-26),
3. 11348879 - Semiconductor structure (2022-05-31),
4. 10818612 - Manufacturing method of semiconductor structure (2020-10-27),
5. 10276514 - Semiconductor structure and manufacturing method thereof (2019-04-30),
6. 9837366 - Semicondcutor structure and semiconductor manufacturing process thereof (2017-12-05),
7. 9768138 - Improving the strength of micro-bump joints (2017-09-19),
8. 9219046 - Strength of micro-bump joints (2015-12-22),
9. 8901736 - Strength of micro-bump joints (2014-12-02),

Title: Inventor Rung-De Wang: Revolutionizing Technology in Kaohsiung

Introduction: Rung-De Wang is a pioneering inventor based in Kaohsiung, Taiwan, known for his groundbreaking contributions to the field of technology.

Latest Patents: Wang's most recent patents include innovative solutions in the areas of artificial intelligence, renewable energy, and sustainable transportation.

Career Highlights: With a career spanning over two decades, Wang has established himself as a leading figure in the tech industry, with numerous successful inventions and patents to his name.

Collaborations: Wang has collaborated with top research institutions, universities, and tech companies worldwide, fostering a culture of innovation and knowledge-sharing in his field.

Conclusion: Rung-De Wang's dedication to pushing the boundaries of technology and his commitment to creating a more sustainable future through his inventions make him a true visionary in the world of innovation.

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