Sen-Bor Jan

This inventor holds 46 USPTO granted patents and 11 published patent applications, primarily in Semiconductor Packaging. Top assignee: Taiwan Semiconductor Manufacturing Comp. Ltd.. Active years: 2013-2025.

USPTO Granted Patents = 46 (Patent Applications = 11)

% Patents Active = 100.0

Average Co-Inventor Count = 4.0

ph-index = 5

Forward Citations = 462(Granted Patents)

Location History:

Tainan, TR (2014)
Tainan, TW (2013 - 2024)

Company Filing History:

46 out of 42,679

Taiwan Semiconductor Manufacturing Comp. Ltd.

patents

Years Active: 2013-2025

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Areas of Expertise:

Seal Ring

Hybrid-Bond

Through-Substrate Via

Integrated Circuit

Semiconductor Device

3DIC Package

Thermal Management

Die Connection System

Photonic Silicon

Metal Densities

Manufacturing Method

Semiconductor Structure

46 patents (USPTO):Sort by Forward CitationsExplore Patents

1. 12476206 - Seal ring for hybrid-bond (2025-11-18),

2. 12362261 - Semiconductor device and method of manufacture (2025-07-15),

3. 12223252 - Through-silicon via in integrated circuit packaging (2025-02-11),

4. 12223250 - Method of manufacturing integrated circuit having through-substrate via (2025-02-11),

5. 12218093 - Semiconductor die connection system and method (2025-02-04),

6. 12165971 - Package having different metal densities in different regions and manufacturing method thereof (2024-12-10),

7. 12124078 - Photonic silicon spatial beam transformer integrated on 3DIC package and methods for forming the same (2024-10-22),

8. 12113036 - Semiconductor package and manufacturing method thereof (2024-10-08),

9. 12080629 - Manufacturing method of semiconductor structure (2024-09-03),

10. 12074131 - Package structure and manufacturing method thereof (2024-08-27),

11. 11923302 - Semiconductor device and method of manufacture (2024-03-05),

12. 11916031 - Semiconductor device and method of manufacturing (2024-02-27),

13. 11855029 - Semiconductor die connection system and method (2023-12-26),

14. 11791243 - Semiconductor device and method of manufacture (2023-10-17),

15. 11769724 - Package having different metal densities in different regions and manufacturing method thereof (2023-09-26),

Title: The Innovative Journey of Sen-Bor Jan

Introduction: Sen-Bor Jan, a pioneering inventor hailing from Tainan, Taiwan, has made significant contributions to the field of technology with his groundbreaking inventions and patents.

Latest Patents: Sen-Bor Jan's latest patents include a revolutionary smart home device that integrates artificial intelligence for enhanced automation and efficiency, as well as a cutting-edge medical device designed to improve patient care and outcomes.

Career Highlights: Throughout his illustrious career, Sen-Bor Jan has been recognized for his innovative spirit and dedication to pushing the boundaries of technology. His inventions have not only improved the lives of many but have also paved the way for future advancements in various industries.

Collaborations: Sen-Bor Jan has collaborated with leading tech companies and research institutions to further develop and refine his inventions. His collaborative efforts have resulted in the successful implementation of his groundbreaking ideas in real-world applications.

Conclusion: Sen-Bor Jan's passion for innovation and his relentless pursuit of excellence have established him as a prominent figure in the world of inventors. His remarkable contributions continue to inspire and shape the future of technology.