The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 11, 2025
Filed:
Feb. 17, 2023
Taiwan Semiconductor Manufacturing Co., Ltd., Hsinchu, TW;
Fong-yuan Chang, Hsinchu, TW;
Chin-Chou Liu, Jhubei, TW;
Chin-Her Chien, Chung-Li, TW;
Cheng-Hung Yeh, Jhunan Township, TW;
Po-Hsiang Huang, Tainan, TW;
Sen-Bor Jan, Tainan, TW;
Yi-Kan Cheng, Taipei, TW;
Hsiu-Chuan Shu, Hsinchu, TW;
Taiwan Semiconductor Manufacturing Co., Ltd., Hsinchu, TW;
Abstract
The present disclosure describes structures and methods for a via structure for three-dimensional integrated circuit (IC) packaging. The via structure includes a middle portion that extends through a planar structure and a first end and a second end each connected to the middle portion and on a different side of the planar structure. One or more of the first end and the second end includes one or more of a plurality of vias and a pseudo metal layer.