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For the Inventor, By the Inventor

Hsinchu, Taiwan

Fong-yuan Chang

This inventor holds 85 USPTO granted patents and 26 published patent applications, primarily in Semiconductor Packaging (CPC class G06F30-392). Top assignees: Taiwan Semiconductor Manufacturing Comp. Ltd., TSMC China Company Limited, Synopsys, Inc.. Active years: 2017-2026.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Fong-yuan Chang. Retrieved from https://idiyas.com/inventor/fong-yuan-chang

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 85 

% Patents Active = 97.6

Average Co-Inventor Count = 5.4

ph-index = 4

Forward Citations = 68(Granted Patents)

Forward Citations (Not Self Cited) = 36(Dec 10, 2025)


Inventors with similar research interests:

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Location History:

  • Hsinchu, TW (2017 - 2024)
  • Hsin-Chu, TW (2024)

Company Filing History:

goldMedal83 out of 42,810 
 
Taiwan Semiconductor Manufacturing Comp. Ltd.
 patents
silverMedal2 out of 130 
 
TSMC China Company Limited
 patents
bronzeMedal1 out of 2,595 
 
Synopsys, Inc.
 patents
4. 1 out of 465 
 
Taiwan Semiconductor Manufacturing Co., Ltd.
 patents
where one patent can have more than one assignee

Years Active: 2017-2026

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Areas of Expertise:
Integrated Circuit
Thermal Dissipation
3D IC
Layout Design
Electrostatic Discharge
Cell Region
Transistor Counts
Silicon Via
Conductive Fillers
Package Structures
Power-Ground Arrangement
Fin Structure
85 patents (USPTO):Explore Patents
1. 12727484 - Interposer with capacitors (2026-09-01),
2. 12696753 - Semiconductor device and method of manufacture (2026-07-28),
3. 12444684 - Semiconductor device including parallel configuration (2025-10-14),
4. 12443782 - Metal cut region location method (2025-10-14),
5. 12423505 - Semiconductor device with cell region (2025-09-23),
6. 12412799 - Integrated circuit package and method (2025-09-09),
7. 12400989 - Arrangement of power-grounds in package structures (2025-08-26),
8. 12368148 - Info packages including thermal dissipation blocks (2025-07-22),
9. 12321680 - Integrated circuit fin structure (2025-06-03),
10. 12315862 - Integrated circuit device with improved layout (2025-05-27),
11. 12277379 - Method and system for generating layout diagram including wiring arrangement (2025-04-14),
12. 12272658 - Method of making electrostatic discharge protection cell and antenna integrated with through silicon via (2025-04-08),
13. 12261095 - Semiconductor package having an encapulant comprising conductive fillers and method of manufacture (2025-03-25),
14. 12223252 - Through-silicon via in integrated circuit packaging (2025-02-11),
15. 12216981 - System and method for generating layout diagram including wiring arrangement (2025-02-04),

Title: Fong-yuan Chang: A Visionary Inventor in Tech Innovation

Introduction: Fong-yuan Chang, based in Hsinchu, TW, is a renowned inventor whose relentless pursuit of innovation has set him apart in the global tech community.

Latest Patents: Among his impressive portfolio of 61 patents, some of his latest inventions include the Method for manufacturing a cell having pins and semiconductor device based on same, which revolutionizes semiconductor device manufacturing, and the Info packages including thermal dissipation blocks, enhancing thermal management in semiconductor devices.

Career Highlights: Fong-yuan Chang has made significant contributions while working at prominent companies such as Taiwan Semiconductor Manufacturing Company Ltd. and Synopsys, Inc. His expertise and groundbreaking inventions have garnered recognition and praise in the industry.

Collaborations: Throughout his career, Fong-yuan Chang has collaborated with talented individuals such as Po-Hsiang Huang and Sheng-Hsiung Chen, fostering a culture of innovation and excellence in his workplace.

Conclusion: Fong-yuan Chang's dedication to pushing the boundaries of technology and his passion for solving complex challenges have solidified his reputation as a visionary inventor. His impact on the tech industry is profound, and his ongoing contributions are shaping the future of innovation worldwide.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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