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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 12400989 B1

PDFFull Text
Date of Patent:
Aug. 26, 2025

Filed:

Jan. 31, 2024

Arrangement of power-grounds in package structures

Applicant:

Taiwan Semiconductor Manufacturing Co., Ltd., Hsinchu, TW;

Inventors:

Ting-Yu Yeh, Hsinchu, TW;

Chun-Hua Chang, Zhubei, TW;

Fong-Yuan Chang, Hsinchu, TW;

Jyh Chwen Frank Lee, Palo Alto, CA (US);

Assignee:

Taiwan Semiconductor Manufacturing Co., Ltd., Hsinchu, TW;

Attorney:

Slater Matsil, LLP

Primary Examiner:

Marlon T Fletcher

Assistant Examiner:

Christina A Sylvia

Int. Cl.
CPC ...
H01L 23/00 (2006.01); H01L 21/56 (2006.01);
U.S. Cl.
CPC ...
H01L 24/20 (2013.01); H01L 24/19 (2013.01); H01L 21/568 (2013.01); H01L 24/13 (2013.01); H01L 2224/13024 (2013.01); H01L 2224/19 (2013.01); H01L 2224/221 (2013.01);
Abstract

A structure includes a redistribution structure, which includes a bottom layer and a plurality of upper layers over the bottom layer. The redistribution structure also includes a power-ground macro extending from a topmost layer in the plurality of upper layers to a bottommost layer in the plurality of upper layers, and a metal pad in the bottom layer and overlapped by the power-ground macro. The metal pad is electrically disconnected from the power-ground macro.

Find Patent Forward Citations

Yeh, Ting-Yu. (2025). Arrangement of power-grounds in package structures (U.S. Patent No. 12400989). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12400989

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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