Chun-Hua Chang

Title: The Innovations of Chun-Hua Chang

Introduction

Chun-Hua Chang is a notable inventor based in Zhubei, Taiwan. He has made significant contributions to the field of semiconductor technology, holding a total of 2 patents. His work focuses on innovative package structures that enhance the performance and efficiency of electronic devices.

Latest Patents

Chun-Hua Chang's latest patents include an arrangement of power-grounds in package structures. This invention features a redistribution structure that consists of a bottom layer and multiple upper layers. The structure incorporates a power-ground macro that extends from the topmost layer to the bottommost layer, along with a metal pad in the bottom layer that is overlapped by the power-ground macro. Notably, the metal pad is electrically disconnected from the power-ground macro, which is a key aspect of this design.

Career Highlights

Chun-Hua Chang is currently employed at Taiwan Semiconductor Manufacturing Company Limited, a leading firm in the semiconductor industry. His expertise and innovative approach have contributed to the company's advancements in technology and product development.

Collaborations

Chun-Hua Chang has collaborated with several talented individuals in his field, including Ting-Yu Yeh and Fong-Yuan Chang. These collaborations have fostered a creative environment that encourages the development of groundbreaking technologies.

Conclusion

Chun-Hua Chang's contributions to semiconductor technology through his patents and collaborations highlight his role as an influential inventor. His work continues to impact the industry positively, paving the way for future innovations.