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Shanghai, China

TSMC China Company Limited

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USPTO Granted Patents = 134

Forward Citations = 53

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143 inventors (with patents filed for the assignee):

He-Zhou Wan (35 out of 42 patents)

Xiu-Li Yang (28 out of 28 patents)

Ching-Wei Wu (21 out of 85 patents)

4. Lei Pan (16 out of 51 patents)

5. Kuan Cheng (14 out of 15 patents)

6. Xin-Yong Wang (11 out of 12 patents)

7. Yaqi Ma (11 out of 12 patents)

8. Lei Pan (10 out of 10 patents)

9. Lu-Ping Kong (9 out of 9 patents)

10. Feng Han (9 out of 100 patents)

11. Ya-Qi Ma (9 out of 9 patents)

12. Zheng-Long Chen (9 out of 9 patents)

13. XinYong Wang (9 out of 19 patents)

14. Li-Chun Tien (7 out of 260 patents)

15. Mu-Yang Ye (7 out of 7 patents)

Core Competencies:

Integrated Circuit

Semiconductor Device

Memory Device

Level Shifter Circuit

Signal Generator

Voltage Regulator

Thermal Substrate Contact

Electrostatic Discharge Protection

LDMOS

Shared Well Structure

Tracking Word Line

Doped Region

134 patents: Sort by Forward Citations

1. 12772574 - Integrated circuit with electrostatic discharge structure (2026-10-20),

2. 12768882 - Built-in self-test (BIST) circuit, integrated circuit device and method (2026-10-20),

3. 12765055 - Integrated circuit with active region jogs (2026-10-13),

4. 12762320 - Circuit arrangements having reduced dependency on layout environment (2026-10-13),

5. 12743069 - System and method for semiconductor fabricating process (2026-09-22),

6. 12713681 - METHOD OF USING SEMICONDUCTOR DEVICE AND METHOD OF MAKING (2026-08-18),

7. 12712547 - INTEGRATED CIRCUIT WITH ESD PROTECTION CIRCUIT (2026-08-18),

8. 12656269 - Apparatus and method for handling wafer storage box (2026-06-16),

9. 12643183 - Method and apparatus for removing expansion bolt for semiconductor processing apparatus (2026-06-02),

10. 12615918 - Display device and method of fabricating the same (2026-04-28),

11. 12613270 - Wafer acceptance test tool and test method using thereof (2026-04-28),

12. 12604535 - Semiconductor device having serially connected transistors with disconnected bodies, and method of manufacturing the same (2026-04-14),

13. 12596301 - Reticle inspection and purging method and tool (2026-04-07),

14. 12575174 - Integrated circuit having transistors with different width source and drain terminals (2026-03-10),

15. 12567862 - Level shifting circuit manufacturing method (2026-03-03),

Company Overview

TSMC China Company Limited, headquartered in Shanghai, specializes in integrated circuit design and semiconductor technologies. The company focuses on developing advanced solutions in areas such as memory devices, level shifter circuits, signal generators, and voltage regulators. With a commitment to innovation, TSMC China plays a crucial role in enhancing the performance and reliability of electronic components, catering to a diverse range of applications in the semiconductor industry.

Profile summary synthesized from public USPTO records and patent filings.

Company Badge

USPTO Data Jan 1 1976 - Oct 27 2026

134 Patents

#26 in Shanghai

#264 in China

#6,022 in the World

Shanghai, China

TSMC China Company Limited

Forward Citations = 53

143 inventors:

He-Zhou Wan (35 out of 42 patents)

Xiu-Li Yang (28 out of 28 patents)

Ching-Wei Wu (21 out of 85 patents)

4. Lei Pan (16 out of 51 patents)

5. Kuan Cheng (14 out of 15 patents)

IDiyas Innovation Intelligence. (2026). Company Patent Portfolio: TSMC China Company Limited. Retrieved from https://idiyas.com/company/tsmc-china-company

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]

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