The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 22, 2026

Filed:

Mar. 22, 2023
Applicants:

Taiwan Semiconductor Manufacturing Company, Ltd., Hsinchu, TW;

Tsmc China Company Limited, Shanghai, CN;

Inventors:

Lei Xu, Shanghai City, CN;

Yukai Hou, Shanghai City, CN;

Fangbo Guo, Shanghai City, CN;

Bin Yuan, Shanghai City, CN;

Jing Wang, Shanghai City, CN;

Bo Li, Shanghai City, CN;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G05B 19/18 (2006.01);
U.S. Cl.
CPC ...
G05B 19/188 (2013.01); G05B 2219/45031 (2013.01);
Abstract

A method includes using a first pump apparatus to control a pressure condition of a first chamber, wherein the first pump apparatus produces a first operation data in a first digital protocol format; using a second pump apparatus to control a pressure condition of a second chamber, wherein the second pump apparatus produces a second operation data in a second digital protocol format different from the first digital protocol format; receiving, by a box device, the first operation data in the first digital protocol format and the second operation data in the second digital protocol format; decoding, by the box device, the first operation data in the first digital protocol format and the second operation data in the second digital protocol format; determining whether the first operation data is in an acceptable range; and adjusting the first pump apparatus to set the first operation data within the acceptable range.


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Xu, Lei. (2026). System and method for semiconductor fabricating process (U.S. Patent No. 12743069). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12743069

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