The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 14, 2025

Filed:

Nov. 27, 2023
Applicant:

Taiwan Semiconductor Manufacturing Company, Ltd., Hsinchu, TW;

Inventors:

Fei Fan Duan, Hsinchu, TW;

Fong-Yuan Chang, Hsinchu, TW;

Chi-Yu Lu, Hsinchu, TW;

Po-Hsiang Huang, Hsinchu, TW;

Chih-Liang Chen, Hsinchu, TW;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/528 (2006.01); G06F 30/398 (2020.01); H01L 23/522 (2006.01); G03F 1/36 (2012.01); G06F 119/12 (2020.01); H01L 23/532 (2006.01);
U.S. Cl.
CPC ...
H01L 23/5283 (2013.01); G06F 30/398 (2020.01); H01L 23/5226 (2013.01); G03F 1/36 (2013.01); G06F 2119/12 (2020.01); H01L 23/53209 (2013.01);
Abstract

A semiconductor device includes first and second active regions extending in parallel in a substrate, a plurality of conductive patterns, each conductive pattern of the plurality of conductive patterns extending on the substrate across each of the first and second active regions, and a plurality of metal lines, each metal line of the plurality of metal lines overlying and extending across each of the first and second active regions. Each conductive pattern of the plurality of conductive patterns is electrically connected in parallel with each metal line of the plurality of metal lines.


Find Patent Forward Citations

Loading…