Zhongli, Taiwan

Chin-Her Chien

This inventor holds 27 USPTO granted patents and 6 published patent applications, primarily in Integrated Circuit Packaging. Top assignees: Taiwan Semiconductor Manufacturing Comp. Ltd., Taiwan Semiconductor Manufacturing Co., Ltd.. Active years: 2015-2026.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Chin-Her Chien. Retrieved from https://idiyas.com/inventor/chin-her-chien

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 27 

% Patents Active = 85.2

Average Co-Inventor Count = 5.6

ph-index = 3

Forward Citations = 15(Granted Patents)


Location History:

  • Taoyuan County, TW (2017 - 2022)
  • Hsinchu, TW (2022)
  • Chung-Li, TW (2015 - 2024)

Company Filing History:


Years Active: 2015-2026

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Areas of Expertise:
Interposer
Capacitors
Photonic Semiconductor
SOIC Chip Architecture
Through-Silicon Via
Heat Dissipation
Stacked Devices
Integrated Antenna
Monolithic Stacked Circuits
Oxide Definition
Buffer Chain
27 patents (USPTO):Explore Patents

Title: Chin-Her Chien: Innovator in Integrated Circuit Technology

Introduction

Chin-Her Chien is a prominent inventor based in Chung-Li, Taiwan, with a remarkable portfolio of 23 patents. His work primarily focuses on advancements in integrated circuit (IC) packaging and thermal management, highlighting the critical innovations that drive modern semiconductor technology.

Latest Patents

Among his latest patents, two significant inventions stand out. The first is titled "Through-silicon via in integrated circuit packaging," which describes a novel via structure for three-dimensional IC packaging. This includes a middle portion that traverses a planar structure, connecting two ends on different sides, potentially incorporating multiple vias and a pseudo metal layer for enhanced performance.

The second patent, "Heat dissipation structures for three-dimensional system on integrated chip structure," details innovative heat dissipating structures that can be implemented in both functional and non-functional areas of three-dimensional systems on chips. This invention aims to maintain the operating temperature of memory chips below approximately 90°C, utilizing a sophisticated design that includes stackable chip layers, thermal interface materials, and effective heat sink solutions.

Career Highlights

Chin-Her Chien currently works at Taiwan Semiconductor Manufacturing Company Limited, a leading organization in the semiconductor industry. His contributions to the field have not only propelled technological advancements but have also established him as a key player in the development of novel integrated circuit solutions.

Collaborations

Throughout his career, Chin-Her has collaborated with esteemed colleagues, including Chin-Chou Liu and Po-Hsiang Huang. These partnerships underscore the collaborative nature of innovation within the semiconductor sector, driving forward the boundaries of what's possible in integrated technology.

Conclusion

Chin-Her Chien's contributions to integrated circuit technology exemplify the spirit of innovation that defines the semiconductor industry. With a robust portfolio of patents and ongoing collaboration with fellow inventors, his work continues to influence the evolution of integrated circuits, ensuring that advancements in this field will thrive for years to come.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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