The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 28, 2021

Filed:

Jul. 10, 2019
Applicant:

Taiwan Semiconductor Manufacturing Co., Ltd., Hsinchu, TW;

Inventors:

Fong-Yuan Chang, Hsinchu, TW;

Chin-Chou Liu, Jhubei, TW;

Chin-Her Chien, Chung-Li, TW;

Po-Hsiang Huang, Tainan, TW;

Noor Mohamed Ettuveettil, Hsinchu, TW;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 23/538 (2006.01); H01L 25/065 (2006.01); H01L 23/532 (2006.01);
U.S. Cl.
CPC ...
H01L 23/5384 (2013.01); H01L 23/53214 (2013.01); H01L 23/53228 (2013.01); H01L 23/53257 (2013.01); H01L 25/0657 (2013.01);
Abstract

The present disclosure describes a semiconductor structure includes a first chip with a first conductive line and a first conductive island formed on the first conductive line. The first chip also includes a first plurality of vias formed in the first conductive island and electrically coupled to the first conductive line. The semiconductor structure further includes a second chip bonded to the first chip, where the second chip includes a second conductive line and a second conductive island formed on the second conductive line. The second chip also includes a second plurality of vias formed in the second conductive island and electrically coupled to the second conductive line.


Find Patent Forward Citations

Chang, Fong-Yuan. (2021). Through silicon via optimization for three-dimensional integrated circuits (U.S. Patent No. 11211333). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/11211333

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Loading…