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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 11367695 B1

PDFFull Text
Date of Patent:
Jun. 21, 2022

Filed:

Jun. 12, 2019

Interposer with capacitors

Applicant:

Taiwan Semiconductor Manufacturing Company, Ltd., Hsinchu, TW;

Inventors:

Fong-yuan Chang, Hsinchu, TW;

Cheng-Hung Yeh, Hsinchu, TW;

Hsiang-Ho Chang, Hsinchu, TW;

Po-Hsiang Huang, Hsinchu, TW;

Chin-Her Chien, Hsinchu, TW;

Sheng-Hsiung Chen, Hsinchu, TW;

Aftab Alam Khan, Hsinchu, TW;

Keh-Jeng Chang, Hsinchu, TW;

Chin-Chou Liu, Hsinchu, TW;

Yi-Kan Cheng, Hsinchu, TW;

Assignee:

TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD., Hsinchu, TW;

Attorney:

Merchant & Gould P.C.

Primary Examiner:

Aaron J Gray

Int. Cl.
CPC ...
H01L 23/64 (2006.01); H01L 23/498 (2006.01); H01L 23/14 (2006.01); H01L 23/00 (2006.01); H01L 25/065 (2006.01); G06F 30/36 (2020.01); G06F 111/20 (2020.01); G06F 119/06 (2020.01);
U.S. Cl.
CPC ...
H01L 23/642 (2013.01); G06F 30/36 (2020.01); H01L 23/49822 (2013.01); H01L 23/49827 (2013.01); H01L 23/49838 (2013.01); H01L 24/16 (2013.01); H01L 25/0652 (2013.01); G06F 2111/20 (2020.01); G06F 2119/06 (2020.01); H01L 23/147 (2013.01); H01L 2224/16225 (2013.01); H01L 2225/06517 (2013.01); H01L 2225/06548 (2013.01); H01L 2924/19041 (2013.01); H01L 2924/19103 (2013.01);
Abstract

An interposer includes one or more capacitors to store charge to provide signals to an integrated circuit electrically connected to the interposer. First connectors to each capacitor are interspersed with second connectors to the capacitors and are spaced apart from adjacent second connectors. The one or more capacitors and the resistances associated with the conductive paths between each capacitor and a connector or another capacitor can be modeled.

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