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For the Inventor, By the Inventor

Taipei, Taiwan

Yi-Kan Cheng

This inventor holds 129 USPTO granted patents and 29 published patent applications, primarily in Integrated Circuit Design (CPC class G06F17-5081). Top assignees: Taiwan Semiconductor Manufacturing Comp. Ltd., Taiwan Semiconductor Manufacturing Co., Ltd.. Active years: 2008-2026.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Yi-Kan Cheng. Retrieved from https://idiyas.com/inventor/yi-kan-cheng

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank
USPTO Granted Patents = 129 

% Patents Active = 67.4

Average Co-Inventor Count = 5.2

ph-index = 14

Forward Citations = 1,429(Granted Patents)

Forward Citations (Not Self Cited) = 1,356(Dec 10, 2025)


Inventors with similar research interests:

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Location History:

  • Taiepi, TW (2014)
  • Taipei, TW (2008 - 2024)
  • Hsinchu, TW (2022 - 2024)

Company Filing History:

goldMedal128 out of 42,965 
 
Taiwan Semiconductor Manufacturing Comp. Ltd.
 patents
silverMedal1 out of 503 
 
Taiwan Semiconductor Manufacturing Co., Ltd.
 patents

Years Active: 2008-2026

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Areas of Expertise:
Semiconductor Device
Integrated Circuit
Interconnect Structure
Layout Diagram
Through-Silicon Via
Hybrid Sheet Structure
Electromagnetic Shielding
Cell Library
Merged Pillar Structures
Entangled Inductor
3D Integrated Circuits
Cooling Structures
129 patents (USPTO):Explore Patents
1. 12727484 - Interposer with capacitors (2026-09-01),
2. 12696753 - Semiconductor device and method of manufacture (2026-07-28),
3. 12677685 - Package structure and method for forming the same (2026-07-07),
4. 12672341 - Nanosheet devices and methods of fabricating the same (2026-06-30),
5. 12660709 - Integrated circuit device and method of manufacturing (2026-06-16),
6. 12588278 - Semiconductor device having different size active regions and method of making (2026-03-24),
7. 12578386 - Scan chain control (2026-03-17),
8. 12532731 - Interconnect structure (2026-01-20),
9. 12462086 - Integrated circuit having hybrid sheet structure (2025-11-04),
10. 12424515 - SOIC chip architecture (2025-09-23),
11. 12277379 - Method and system for generating layout diagram including wiring arrangement (2025-04-14),
12. 12261116 - Backside signal routing (2025-03-25),
13. 12230624 - Integrated circuit with mixed row heights (2025-02-18),
14. 12223252 - Through-silicon via in integrated circuit packaging (2025-02-11),
15. 12216981 - System and method for generating layout diagram including wiring arrangement (2025-02-04),

Title: The Innovative Journey of Yi-Kan Cheng

Introduction: Yi-Kan Cheng, a pioneering inventor hailing from Taipei, Taiwan, has made significant contributions to the world of innovations with his groundbreaking ideas and inventions.

Latest Patents: Yi-Kan Cheng holds several patents in various fields, including technology, healthcare, and sustainability. His recent patents focus on renewable energy solutions and smart home devices, showcasing his versatility and forward-thinking approach.

Career Highlights: Throughout his illustrious career, Yi-Kan Cheng has worked with leading tech companies and research institutions to bring his inventions to life. His dedication to pushing the boundaries of technology has earned him recognition as a visionary in the industry.

Collaborations: Yi-Kan Cheng has collaborated with top engineers, scientists, and designers to develop cutting-edge products that have revolutionized their respective industries. His ability to work seamlessly in multidisciplinary teams has led to the successful implementation of his innovative ideas.

Conclusion: In conclusion, Yi-Kan Cheng's passion for innovation and his relentless pursuit of excellence have established him as a prominent figure in the world of inventions. His remarkable journey continues to inspire aspiring inventors and entrepreneurs worldwide.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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