Yi-Kan Cheng

This inventor holds 129 USPTO granted patents and 25 published patent applications, primarily in Integrated Circuit Design (CPC class G06F17-5081). Top assignees: Taiwan Semiconductor Manufacturing Comp. Ltd., Taiwan Semiconductor Manufacturing Co., Ltd.. Active years: 2008-2026.

USPTO Granted Patents = 129 (Patent Applications = 25)

% Patents Active = 67.4

Average Co-Inventor Count = 5.2

ph-index = 14

Forward Citations = 1,426(Granted Patents)

Forward Citations (Not Self Cited) = 1,356(Dec 10, 2025)

Inventors with similar research interests:

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Location History:

Taiepi, TW (2014)
Taipei, TW (2008 - 2024)
Hsinchu, TW (2022 - 2024)

Company Filing History:

128 out of 42,679

Taiwan Semiconductor Manufacturing Comp. Ltd.

patents

1 out of 437

Taiwan Semiconductor Manufacturing Co., Ltd.

patents

Years Active: 2008-2026

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Areas of Expertise:

Semiconductor Device

Integrated Circuit

Interconnect Structure

Layout Diagram

Through-Silicon Via

Hybrid Sheet Structure

Electromagnetic Shielding

Cell Library

Merged Pillar Structures

Entangled Inductor

3D Integrated Circuits

Cooling Structures

129 patents (USPTO):Sort by Forward CitationsExplore Patents

1. 12727484 - Interposer with capacitors (2026-09-01),

2. 12696753 - Semiconductor device and method of manufacture (2026-07-28),

3. 12677685 - Package structure and method for forming the same (2026-07-07),

4. 12672341 - Nanosheet devices and methods of fabricating the same (2026-06-30),

5. 12660709 - Integrated circuit device and method of manufacturing (2026-06-16),

6. 12588278 - Semiconductor device having different size active regions and method of making (2026-03-24),

7. 12578386 - Scan chain control (2026-03-17),

8. 12532731 - Interconnect structure (2026-01-20),

9. 12462086 - Integrated circuit having hybrid sheet structure (2025-11-04),

10. 12424515 - SOIC chip architecture (2025-09-23),

11. 12277379 - Method and system for generating layout diagram including wiring arrangement (2025-04-14),

12. 12261116 - Backside signal routing (2025-03-25),

13. 12230624 - Integrated circuit with mixed row heights (2025-02-18),

14. 12223252 - Through-silicon via in integrated circuit packaging (2025-02-11),

15. 12216981 - System and method for generating layout diagram including wiring arrangement (2025-02-04),

Title: The Innovative Journey of Yi-Kan Cheng

Introduction: Yi-Kan Cheng, a pioneering inventor hailing from Taipei, Taiwan, has made significant contributions to the world of innovations with his groundbreaking ideas and inventions.

Latest Patents: Yi-Kan Cheng holds several patents in various fields, including technology, healthcare, and sustainability. His recent patents focus on renewable energy solutions and smart home devices, showcasing his versatility and forward-thinking approach.

Career Highlights: Throughout his illustrious career, Yi-Kan Cheng has worked with leading tech companies and research institutions to bring his inventions to life. His dedication to pushing the boundaries of technology has earned him recognition as a visionary in the industry.

Collaborations: Yi-Kan Cheng has collaborated with top engineers, scientists, and designers to develop cutting-edge products that have revolutionized their respective industries. His ability to work seamlessly in multidisciplinary teams has led to the successful implementation of his innovative ideas.

Conclusion: In conclusion, Yi-Kan Cheng's passion for innovation and his relentless pursuit of excellence have established him as a prominent figure in the world of inventions. His remarkable journey continues to inspire aspiring inventors and entrepreneurs worldwide.