The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 04, 2025

Filed:

Aug. 10, 2023
Applicant:

Taiwan Semiconductor Manufacturing Company, Ltd., Hsinchu, TW;

Inventors:

Shang-Wei Fang, Hsinchu, TW;

Kam-Tou Sio, Hsinchu, TW;

Wei-Cheng Lin, Hsinchu, TW;

Jiann-Tyng Tzeng, Hsinchu, TW;

Lee-Chung Lu, Hsinchu, TW;

Yi-Kan Cheng, Hsinchu, TW;

Chung-Hsing Wang, Hsinchu, TW;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G06F 30/392 (2020.01); G06F 30/398 (2020.01);
U.S. Cl.
CPC ...
G06F 30/392 (2020.01); G06F 30/398 (2020.01);
Abstract

An integrated circuit (IC) includes first through fourth nano-sheet structures extending in a first direction and having respective first through fourth widths along a second direction perpendicular to the first direction, and first through fourth via structures electrically connected to corresponding ones of the first through fourth nano-sheet structures. The second width has a value greater than that of the third width. A width of the second via structure along the second direction has a value greater than that of a width of the third via structure along the second direction. The second and third nano-sheet structures are positioned between the first and fourth nano-sheet structures. The second and third via structures are configured to electrically connect the second and third nano-sheet structures to a first portion of a back-side power distribution structure configured to carry one of a power supply voltage or a reference voltage. The first and fourth via structures are configured to electrically connect the first and fourth nano-sheet structures to a second portion of the back-side power distribution structure configured to carry the other of the power supply voltage or the reference voltage.


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