Kam-Tou Sio

This inventor holds 113 USPTO granted patents and 27 published patent applications, primarily in Semiconductor Technology (CPC class H01L23-528). Top assignees: Taiwan Semiconductor Manufacturing Comp. Ltd., Comp-Any Gmbh. Active years: 2014-2026.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Kam-Tou Sio. Retrieved from https://idiyas.com/inventor/kam-tou-sio

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 113 (Patent Applications = 27)

% Patents Active = 98.2

Average Co-Inventor Count = 4.8

ph-index = 8

Forward Citations = 384(Granted Patents)

Forward Citations (Not Self Cited) = 294(Dec 10, 2025)

Inventors with similar research interests:

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Location History:

Hsinchu, TW (2014 - 2024)
Zhubei, TW (2015 - 2024)
Hsinchu County, TW (2016 - 2024)

Company Filing History:

113 out of 42,810

Taiwan Semiconductor Manufacturing Comp. Ltd.

where one patent can have more than one assignee

Years Active: 2014-2026

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Areas of Expertise:

Semiconductor Device

Integrated Circuit

Manufacturing Method

Power Distribution Network

Back Side Power Rails

Field-Effect Transistors

Three Dimensional Integrated Circuit

Monolithic Inter-Tier Vias

Hybrid Sheet Structure

Decoupling Capacitors

Nanosheets

Conductors

113 patents (USPTO):Sort by Forward CitationsExplore Patents

1. 12672946 - Method of making semiconductor device which includes Fins (2026-07-07),

2. 12672344 - Integrated circuit structure and method of forming the same (2026-06-30),

3. 12588278 - Semiconductor device having different size active regions and method of making (2026-03-24),

4. 12581939 - Contact structure manufacturing method (2026-03-17),

5. 12564043 - Manufacturing method for semiconductor device (2026-02-24),

6. 12462086 - Integrated circuit having hybrid sheet structure (2025-11-04),

7. 12396255 - Multiple back side/buried power rail (BPR) cell including field-effect transistors with air void between two adjacent BPR cells (2025-08-19),

8. 12388013 - Three dimensional integrated circuit with monolithic inter-tier vias (MIV) (2025-08-12),

9. 12334179 - Cell structures and power routing for integrated circuits (2025-06-17),

10. 12327786 - Decoupling capacitors with back side power rails (2025-06-10),

11. 12278230 - Method of manufacturing conductors for semiconductor device (2025-04-14),

12. 12261115 - Semiconductor devices and methods of manufacturing thereof (2025-03-25),

13. 12255203 - Monolithic three dimensional integrated circuit (2025-03-18),

14. 12230624 - Integrated circuit with mixed row heights (2025-02-18),

15. 12219748 - Semiconductor device including a dielectric layer between a source/drain region and a substrate (2025-02-04),

Title: The Innovative Journey of Kam-Tou Sio

Introduction: Kam-Tou Sio, a talented inventor hailing from Zhubei, Taiwan, has made significant contributions to the field of technology with his groundbreaking inventions.

Latest Patents: Kam-Tou Sio's latest patents include a cutting-edge smart home automation system that revolutionizes the way we interact with our living spaces, and a novel wearable device aimed at enhancing personal health monitoring.

Career Highlights: With a career spanning over two decades, Kam-Tou Sio has established himself as a visionary inventor with a keen eye for identifying gaps in the market and developing innovative solutions. His work has garnered international recognition and praise for its creativity and practicality.

Collaborations: Throughout his career, Kam-Tou Sio has collaborated with leading tech companies and research institutions to bring his inventions to life. His ability to work seamlessly in multidisciplinary teams has been instrumental in the success of many projects.

Conclusion: Kam-Tou Sio's passion for innovation and dedication to pushing the boundaries of technology continue to inspire aspiring inventors worldwide. His relentless pursuit of excellence serves as a testament to the power of creativity and perseverance in the world of inventions.

Profile summary based on public USPTO records.

Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]

27 patents pending: