The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 24, 2026
Filed:
Jan. 19, 2023
Taiwan Semiconductor Manufacturing Company, Ltd., Hsinchu, TW;
Te-Hsin Chiu, Hsinchu, TW;
Wei-An Lai, Hsinchu, TW;
Meng-Hung Shen, Hsinchu, TW;
Wei-Cheng Lin, Hsinchu, TW;
Jiann-Tyng Tzeng, Hsinchu, TW;
Kam-Tou Sio, Hsinchu, TW;
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD., Hsinchu, TW;
Abstract
A method of making a semiconductor structure includes defining a first recess in an insulation layer. The method further includes forming a protection layer along a sidewall of the first recess. The method further includes forming a first conductive line in the first recess and in direct contact with the protection layer. The method further includes depositing a first insulation material over the first conductive line. The method further includes defining a second recess in the first insulation material. The method further includes forming a second conductive line in the second recess. The method further includes forming a via extending from the second conductive line, wherein the via directly contacts a sidewall of the protection layer.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile