The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 18, 2025

Filed:

Apr. 30, 2021
Applicant:

Taiwan Semiconductor Manufacturing Company, Ltd., Hsinchu, TW;

Inventors:

Kam-Tou Sio, Zhubei, TW;

Jiann-Tyng Tzeng, Hsinchu, TW;

Shih-Wei Peng, Hsinchu, TW;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 27/06 (2006.01); H01L 21/822 (2006.01); H01L 23/522 (2006.01); H01L 23/528 (2006.01);
U.S. Cl.
CPC ...
H01L 27/0688 (2013.01); H01L 21/8221 (2013.01); H01L 23/5226 (2013.01); H01L 23/528 (2013.01);
Abstract

A monolithic three dimensional integrated circuit is provided. The monolithic three dimensional integrated circuit includes a first cell layer having a first cell having a first active component of the monolithic three dimensional integrated circuit. A second layer having a second cell including a second active component. The second cell layer is formed vertically above the first cell layer. The first cell layer having the first active component and the second cell layer having the second active component are formed in a single die. The first cell has a smaller metal pitch than the second cell. A buried via electrically couples the first active component of the first cell of the first cell layer with the second active component of the second cell of the second cell layer.


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