Hsinchu, Taiwan

Chung-Hsing Wang

This inventor holds 23 USPTO granted patents and 21 published patent applications, primarily in Integrated Circuit Design. Top assignee: Taiwan Semiconductor Manufacturing Comp. Ltd.. Active years: 2024-2026.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Chung-Hsing Wang. Retrieved from https://idiyas.com/inventor/chung-hsing-wang-8oitird2

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 23 

% Patents Active = 82.6

Average Co-Inventor Count = 5.2

ph-index = 1

Forward Citations = 1(Granted Patents)


Company Filing History:


Years Active: 2024-2026

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Areas of Expertise:
Backside Conducting Lines
Semiconductor Device
Clock Signal Distribution
Power Grid Structures
Integrated Circuit Layout
Hybrid Sheet Structure
Conductive Line Structures
Context Aware Design
Merged Pillar Structures
Netlist Generation
Frontside Power Mesh
Standard-Cell Adapted Arrangement
23 patents (USPTO):Explore Patents

Title: Chung-Hsing WANG: Pioneering Inventor from Hsinchu

Introduction: Chung-Hsing WANG is a distinguished inventor hailing from Hsinchu, Taiwan, known for his groundbreaking contributions to the field of technology and innovation.

Latest Patents: Wang's latest patents focus on advancements in semiconductor technology, particularly in the development of cutting-edge microchips with enhanced processing capabilities.

Career Highlights: With a career spanning over two decades, Wang has held key positions in various tech companies, leading research and development teams to create innovative solutions in the semiconductor industry.

Collaborations: Wang has collaborated with leading research institutions and universities worldwide, fostering a culture of innovation and knowledge-sharing in the field of technology.

Conclusion: Chung-Hsing Wang's relentless pursuit of innovation and his significant contributions to the semiconductor industry have solidified his position as a pioneering inventor in Hsinchu, Taiwan.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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