The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 15, 2026
Filed:
Mar. 25, 2024
Taiwan Semiconductor Manufacturing Company, Ltd., Hsinchu, TW;
Wei-An Lai, Hsinchu, TW;
Shih-Wei Peng, Hsinchu, TW;
Te-Hsin Chiu, Hsinchu, TW;
Jiann-Tyng Tzeng, Hsinchu, TW;
Chung-Hsing Wang, Hsinchu, TW;
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD., Hsinchu, TW;
Abstract
A method includes fabricating active-region structures extending in a first direction on a substrate, and fabricating a plurality of gate-conductors extending in a second direction above the substrate. The method also includes fabricating a backside horizontal conducting line in a backside first conducting layer below the substrate and having the backside horizontal conducting line extending in the first direction across a vertical boundary of a circuit cell. The method further includes fabricating a pin-connector that is connected to the backside horizontal conducting line, and fabricating a backside vertical conducting line extending in the second direction in a backside second conducting layer below the backside first conducting layer. The pin-connector is directly connected between the backside horizontal conducting line and the backside vertical conducting line.