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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 12165971 B1

PDFFull Text
Date of Patent:
Dec. 10, 2024

Filed:

Jul. 21, 2023

Package having different metal densities in different regions and manufacturing method thereof

Applicant:

Taiwan Semiconductor Manufacturing Company, Ltd., Hsinchu, TW;

Inventors:

Hsien-Wei Chen, Hsinchu, TW;

Jie Chen, New Taipei, TW;

Ming-Fa Chen, Taichung, TW;

Sen-Bor Jan, Tainan, TW;

Assignee:

Taiwan Semiconductor Manufacturing Company, Ltd., Hsinchu, TW;

Attorney:

JCIPRNET

Primary Examiner:

Mamadou L Diallo

Int. Cl.
CPC ...
H01L 23/522 (2006.01); H01L 21/56 (2006.01); H01L 23/00 (2006.01); H01L 23/31 (2006.01);
U.S. Cl.
CPC ...
H01L 23/5227 (2013.01); H01L 21/56 (2013.01); H01L 23/3107 (2013.01); H01L 24/03 (2013.01); H01L 24/05 (2013.01); H01L 24/20 (2013.01); H01L 2224/03011 (2013.01);
Abstract

A package has a first region and a second region encircled by the first region. The package includes a first die, a second die, an encapsulant, and an inductor. The first die is located in both the first region and the second region. The second die is bonded to the first die and is completely located within the first region. The encapsulant laterally encapsulates the second die. The encapsulant is located in both the first region and the second region. The inductor is completely located within the second region. A metal density in the first region is greater than a metal density in the second region.

Find Patent Forward Citations

Chen, Hsien-Wei. (2024). Package having different metal densities in different regions and manufacturing method thereof (U.S. Patent No. 12165971). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12165971

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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