The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 11, 2025
Filed:
Aug. 08, 2023
Applicant:
Taiwan Semiconductor Manufacturing Co., Ltd., Hsinchu, TW;
Inventors:
Kuan-Yu Huang, Taipei, TW;
Li-Chung Kuo, Taipei, TW;
Sung-Hui Huang, Dongshan Township, TW;
Shang-Yun Hou, Jubei, TW;
Assignee:
Taiwan Semiconductor Manufacturing Co., Ltd., Hsinchu, TW;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 25/065 (2023.01); H01L 23/00 (2006.01); H01L 23/31 (2006.01); H01L 23/498 (2006.01); H01L 25/00 (2006.01); H01L 25/18 (2023.01);
U.S. Cl.
CPC ...
H01L 25/0655 (2013.01); H01L 23/3185 (2013.01); H01L 23/49833 (2013.01); H01L 24/32 (2013.01); H01L 24/33 (2013.01); H01L 24/73 (2013.01); H01L 24/92 (2013.01); H01L 25/50 (2013.01); H01L 25/18 (2013.01); H01L 2224/32057 (2013.01); H01L 2224/33051 (2013.01); H01L 2224/33152 (2013.01); H01L 2224/3316 (2013.01); H01L 2224/73204 (2013.01); H01L 2224/9211 (2013.01); H01L 2224/92125 (2013.01);
Abstract
A method includes bonding a first package component over a second package component, dispensing a first underfill between the first package component and the second package component, and bonding a third package component over the second package component. A second underfill is between the third package component and the second package component. The first underfill and the second underfill are different types of underfills.