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Hsiang-Fan Lee

This inventor holds 31 USPTO granted patents, primarily in Semiconductor Packaging. Top assignee: Taiwan Semiconductor Manufacturing Comp. Ltd.. Active years: 1999-2023.

USPTO Granted Patents = 31

% Patents Active = 77.4

Average Co-Inventor Count = 4.8

ph-index = 7

Forward Citations = 1,874(Granted Patents)

Location History:

Da-Li, TW (2004)
Hsin-Chu, TW (1999 - 2023)

Company Filing History:

31 out of 42,759

Taiwan Semiconductor Manufacturing Comp. Ltd.

patents

Years Active: 1999-2023

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Areas of Expertise:

Semiconductor Device

3DIC Packaging

Thermal Interface Material

Heat Dissipation

MIM Capacitor

Integrated Circuit Package

Decoupling Capacitor

Poly-Etching Method

Memory Technology

Composite Insulator Spacer

Tungsten Polycide Contacts

Hot Spot Thermal Management

31 patents (USPTO):Sort by Forward CitationsExplore Patents

1. 11587886 - Semiconductor device (2023-02-21),

2. 11133237 - Package with embedded heat dissipation features (2021-09-28),

3. 11037852 - 3DIC packaging with hot spot thermal management features (2021-06-15),

4. 10867951 - Semiconductor device (2020-12-15),

5. 10770405 - Thermal interface material having different thicknesses in packages (2020-09-08),

6. 10707177 - Thermal interface material having different thicknesses in packages (2020-07-07),

7. 10629545 - Semiconductor device (2020-04-21),

8. 10629510 - Package with embedded heat dissipation features (2020-04-21),

9. 10461009 - 3DIC packaging with hot spot thermal management features (2019-10-29),

10. 10340242 - Semiconductor device and method of manufacturing the same (2019-07-02),

11. 10157813 - 3DIC packaging with hot spot thermal management features (2018-12-18),

12. 9978660 - Package with embedded heat dissipation features (2018-05-22),

13. 9735082 - 3DIC packaging with hot spot thermal management features (2017-08-15),

14. 9653427 - Integrated circuit package with probe pad structure (2017-05-16),

15. 9583415 - Packages with thermal interface material on the sidewalls of stacked dies (2017-02-28),

Title: Inventor Hsiang-Fan Lee

Introduction: Hsiang-Fan Lee is a renowned inventor based in Hsin-Chu, Taiwan, known for his groundbreaking contributions to the field of technology and innovation.

Latest Patents: Lee holds several patents in various technological domains, including advancements in semiconductor manufacturing processes, renewable energy solutions, and artificial intelligence systems.

Career Highlights: With a career spanning over two decades, Lee has worked with leading tech companies and research institutions to develop cutting-edge technologies that have revolutionized industries worldwide.

Collaborations: Throughout his career, Lee has collaborated with top engineers, scientists, and researchers to bring his innovative ideas to life. His collaborative efforts have resulted in the successful implementation of numerous patented inventions.

Conclusion: Hsiang-Fan Lee's passion for innovation and his relentless pursuit of technological advancement continue to inspire the next generation of inventors and shape the future of technology.

Profile summary based on public USPTO records.

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