The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 16, 2017

Filed:

Feb. 25, 2016
Applicant:

Taiwan Semiconductor Manufacturing Company, Ltd., Hsin-Chu, TW;

Inventors:

Chi-Hsi Wu, Hsin-Chu, TW;

Chen-Hua Yu, Hsin-Chu, TW;

Hsiang-Fan Lee, Hsin-Chu, TW;

Shih-Peng Tai, Xinpu Township, TW;

Tang-Jung Chiu, Hsin-Chu, TW;

Wen-Chih Chiou, Zhunan Township, TW;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 25/065 (2006.01); H01L 21/66 (2006.01); H01L 21/78 (2006.01); H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
H01L 25/0652 (2013.01); H01L 21/78 (2013.01); H01L 22/14 (2013.01); H01L 22/20 (2013.01); H01L 22/32 (2013.01); H01L 24/09 (2013.01); H01L 24/81 (2013.01); H01L 24/97 (2013.01); H01L 2224/0401 (2013.01); H01L 2224/09515 (2013.01); H01L 2224/16225 (2013.01); H01L 2224/32225 (2013.01); H01L 2224/73204 (2013.01); H01L 2224/81007 (2013.01); H01L 2225/06513 (2013.01); H01L 2225/06582 (2013.01); H01L 2225/06596 (2013.01); H01L 2924/181 (2013.01);
Abstract

A package includes a substrate, the substrate having a first side and a second side, the second side being opposite the first side, and a stack of dies on a first side of the substrate. The package further includes a probing pad on the first side of the substrate, the probing pad being electrically coupled to the stack of dies, and a contact pad on the second side of the substrate, the contact pad being electrically coupled to the stack of dies.


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