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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 9583415 B1

PDFFull Text
Expired
Date of Patent:
Feb. 28, 2017

Filed:

Oct. 17, 2013

Packages with thermal interface material on the sidewalls of stacked dies

Applicant:

Taiwan Semiconductor Manufacturing Company, Ltd., Hsin-Chu, TW;

Inventors:

Chen-Hua Yu, Hsin-Chu, TW;

Wensen Hung, Zhubei, TW;

Szu-Po Huang, Taichung, TW;

An-Jhih Su, Bade, TW;

Hsiang-Fan Lee, Hsin-Chu, TW;

Kim Hong Chen, Fremont, CA (US);

Chi-Hsi Wu, Hsin-Chu, TW;

Shin-Puu Jeng, Hsin-Chu, TW;

Assignee:

Taiwan Semiconductor Manufacturing Company, Ltd., Hsin-Chu, TW;

Attorney:

Slater Matsil, LLP

Primary Examiner:

Fernando L Toledo

Assistant Examiner:

Christine L Hagan

Int. Cl.
CPC ...
H01L 23/42 (2006.01); H01L 23/367 (2006.01); H01L 23/36 (2006.01); H01L 23/31 (2006.01); H01L 23/498 (2006.01); H01L 23/10 (2006.01); H01L 23/538 (2006.01);
U.S. Cl.
CPC ...
H01L 23/42 (2013.01); H01L 23/36 (2013.01); H01L 23/3675 (2013.01); H01L 23/10 (2013.01); H01L 23/3128 (2013.01); H01L 23/49816 (2013.01); H01L 23/5385 (2013.01); H01L 2224/16145 (2013.01); H01L 2224/16225 (2013.01); H01L 2224/32225 (2013.01); H01L 2224/73204 (2013.01); H01L 2924/0002 (2013.01); H01L 2924/15174 (2013.01); H01L 2924/15311 (2013.01);
Abstract

A package includes a die stack that includes at least two stacked dies, and a Thermal Interface Material (TIM). The TIM includes a top portion over and contacting a top surface of the die stack, and a sidewall portion extending from the top portion down to lower than at least one of the at least two stacked dies. A first metallic heat-dissipating feature is over and contacting the top portion of TIM. A second metallic heat-dissipating feature has a sidewall contacting a sidewall of the sidewall portion of the TIM.

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