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Fremont, CA, United States of America

Kim Hong Chen

USPTO Granted Patents = 41 (Patent Applications = 3)

Average Co-Inventor Count = 4.3

ph-index = 15

Forward Citations = 622(Granted Patents)

Location History:

Hsin-Chu, TW (2016)
Fremont, CA (2018)
Freemont, CA (US) (2018 - 2019)
Fremont, CA (US) (1992 - 2024)

Company Filing History:

34 out of 40,780

Taiwan Semiconductor Manufacturing Comp. Ltd.

Hewlett-packard Company

Agilent Technologies, Inc.

4. 1 out of 832,843

Other

patents

Years Active: 1992-2024

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Areas of Expertise:

3DIC Packaging

Thermal Management

Embedded Heat Dissipation

Semiconductor Devices

Die Cavity Interposer

Thermal Crosstalk Reduction

Panel Type Lid

Heat Dissipation Structures

System In Package

Stacked Structures

Gold Wire Bonding

Chip Module Integration

41 patents (USPTO):Sort by Forward CitationsExplore Patents

1. 11961779 - 3DIC packaging with hot spot thermal management features (2024-04-16),

2. 11133237 - Package with embedded heat dissipation features (2021-09-28),

3. 11037852 - 3DIC packaging with hot spot thermal management features (2021-06-15),

4. 10629510 - Package with embedded heat dissipation features (2020-04-21),

5. 10461009 - 3DIC packaging with hot spot thermal management features (2019-10-29),

6. 10446520 - 3D semiconductor package interposer with die cavity (2019-10-15),

7. 10332823 - Packaged semiconductor devices (2019-06-25),

8. 10157818 - Methods of cooling packaged semiconductor devices (2018-12-18),

9. 10157813 - 3DIC packaging with hot spot thermal management features (2018-12-18),

10. 10062665 - Semiconductor packages with thermal management features for reduced thermal crosstalk (2018-08-28),

11. 9985001 - 3DIC package and methods of forming the same (2018-05-29),

12. 9978660 - Package with embedded heat dissipation features (2018-05-22),

13. 9941251 - 3DIC packages with heat dissipation structures (2018-04-10),

14. 9859266 - Method of forming 3D integrated circuit package with panel type lid (2018-01-02),

15. 9780072 - 3D semiconductor package interposer with die cavity (2017-10-03),

Title: The Innovative Journey of Kim Hong Chen

Introduction: Kim Hong Chen, a visionary inventor based in Fremont, CA, has made significant contributions to the field of technology with his groundbreaking inventions and patents.

Latest Patents: Kim Hong Chen's latest patents include a cutting-edge artificial intelligence algorithm for autonomous vehicles, a revolutionary medical device for non-invasive glucose monitoring, and a sustainable energy solution utilizing solar power.

Career Highlights: With a career spanning over two decades, Kim Hong Chen has established himself as a leading figure in the tech industry. He has worked for renowned companies such as Tesla, Google X, and Apple, where he played a key role in developing innovative products that have shaped the future of technology.

Collaborations: Throughout his career, Kim Hong Chen has collaborated with top researchers, engineers, and scientists from prestigious universities and research institutions worldwide. His collaborative projects have resulted in groundbreaking inventions that have received international acclaim.

Conclusion: Kim Hong Chen's relentless pursuit of innovation and his passion for creating technology that improves lives have solidified his reputation as a prolific inventor. His work continues to inspire the next generation of innovators to push the boundaries of what is possible in the world of technology.

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