The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 29, 2018
Filed:
Nov. 14, 2016
Applicant:
Taiwan Semiconductor Manufacturing Company, Ltd., Hsin-Chu, TW;
Inventors:
Kim Hong Chen, Freemont, CA (US);
Szu-Po Huang, Taichung, TW;
Shin-Puu Jeng, Hsin-Chu, TW;
Wensen Hung, Zhubei, TW;
Assignee:
Taiwan Semiconductor Manufacturing Company, Ltd., Hsin-Chu, TW;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/768 (2006.01); H01L 21/56 (2006.01); H01L 23/00 (2006.01); H01L 23/31 (2006.01); H01L 23/522 (2006.01); H01L 25/065 (2006.01); H01L 23/498 (2006.01); H01L 21/48 (2006.01); H01L 23/538 (2006.01); H01L 21/288 (2006.01); H01L 21/3105 (2006.01); H01L 21/683 (2006.01); H01L 25/10 (2006.01); H01L 25/11 (2006.01); H01L 25/03 (2006.01); H01L 25/00 (2006.01); H01L 25/07 (2006.01);
U.S. Cl.
CPC ...
H01L 25/0657 (2013.01); H01L 21/288 (2013.01); H01L 21/31053 (2013.01); H01L 21/486 (2013.01); H01L 21/56 (2013.01); H01L 21/561 (2013.01); H01L 21/565 (2013.01); H01L 21/6835 (2013.01); H01L 21/76802 (2013.01); H01L 21/76837 (2013.01); H01L 21/76877 (2013.01); H01L 23/3128 (2013.01); H01L 23/3135 (2013.01); H01L 23/49816 (2013.01); H01L 23/5226 (2013.01); H01L 23/5384 (2013.01); H01L 23/5389 (2013.01); H01L 24/11 (2013.01); H01L 24/19 (2013.01); H01L 24/20 (2013.01); H01L 24/81 (2013.01); H01L 24/83 (2013.01); H01L 25/0652 (2013.01); H01L 25/0655 (2013.01); H01L 25/105 (2013.01); H01L 25/50 (2013.01); H01L 21/568 (2013.01); H01L 23/3114 (2013.01); H01L 23/49822 (2013.01); H01L 23/522 (2013.01); H01L 24/97 (2013.01); H01L 25/00 (2013.01); H01L 25/03 (2013.01); H01L 25/065 (2013.01); H01L 25/074 (2013.01); H01L 25/117 (2013.01); H01L 2221/68359 (2013.01); H01L 2224/0231 (2013.01); H01L 2224/04105 (2013.01); H01L 2224/12105 (2013.01); H01L 2224/13025 (2013.01); H01L 2224/13082 (2013.01); H01L 2224/13083 (2013.01); H01L 2224/16105 (2013.01); H01L 2224/16145 (2013.01); H01L 2224/16148 (2013.01); H01L 2224/16225 (2013.01); H01L 2224/16235 (2013.01); H01L 2224/73204 (2013.01); H01L 2224/81005 (2013.01); H01L 2224/81191 (2013.01); H01L 2224/81193 (2013.01); H01L 2224/81801 (2013.01); H01L 2224/83005 (2013.01); H01L 2224/838 (2013.01); H01L 2224/9202 (2013.01); H01L 2224/94 (2013.01); H01L 2224/96 (2013.01); H01L 2224/97 (2013.01); H01L 2225/06513 (2013.01); H01L 2225/06517 (2013.01); H01L 2225/06548 (2013.01); H01L 2924/15311 (2013.01);
Abstract
A package includes a first molding material, a first device die molded in the molding material, a Through Via (TV) penetrating through the first molding material, and a redistribution line over the first molding material. The redistribution line is electrically connected to the TV. A second device die is over and bonded to the first device die through flip-chip bonding. A second molding material molds the second device die therein.