Taichung, Taiwan

Szu-Po Huang

This inventor holds 29 USPTO granted patents and 2 published patent applications, primarily in 3DIC Packaging. Top assignee: Taiwan Semiconductor Manufacturing Comp. Ltd.. Active years: 2015-2024.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Szu-Po Huang. Retrieved from https://idiyas.com/inventor/szu-po-huang

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 29 

% Patents Active = 79.3

Average Co-Inventor Count = 4.8

ph-index = 11

Forward Citations = 266(Granted Patents)


Location History:

  • Hsin-Chu, TW (2016)
  • Taichung, TW (2015 - 2024)

Company Filing History:


Years Active: 2015-2024

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Areas of Expertise:
3DIC Packaging
Thermal Management
Heat Dissipation
Semiconductor Device
3D Semiconductor Package
Thermal Crosstalk
Embedded Heat Dissipation
Thermal Interface Material
Heat Dissipating Rings
Die Cavity
Heat Sinks
Package Design
29 patents (USPTO):Explore Patents

Szu-Po Huang: Innovator in Semiconductor Technology

Introduction

Szu-Po Huang is an influential inventor based in Taichung, Taiwan, known for his significant contributions to semiconductor technology. With a remarkable portfolio of 29 patents, he continues to push the boundaries of innovation in the field.

Latest Patents

Huang's latest patents showcase his expertise in semiconductor devices and advanced packaging solutions. One notable invention is a semiconductor device that features a substrate, an electronic component, a stiffener ring, and an adhesive ring. The innovative design optimizes the heights of the corner and side parts of the stiffener ring, along with the thicknesses of the adhesive ring's portions, enhancing device performance.

Another significant patent is the 3DIC packaging with hot spot thermal management features. This advanced package includes a substrate with a conductive layer, strategically arranged die stacks, and high thermal conductivity materials to manage heat effectively. The inclusion of a contour ring further enhances thermal transfer, showcasing Huang's commitment to addressing thermal management challenges in semiconductor technology.

Career Highlights

Szu-Po Huang's professional journey is closely tied to Taiwan Semiconductor Manufacturing Company Limited, where he has actively contributed to innovative semiconductor solutions. His role in the company has allowed him to apply his inventive capabilities to real-world applications, impacting the industry significantly.

Collaborations

In his pursuit of innovation, Huang collaborates with talented coworkers such as Wensen Hung and Kim Hong Chen. Together, they share knowledge and expertise, further enhancing the innovative environment within their company and making strides in semiconductor research and development.

Conclusion

Szu-Po Huang stands out as a pivotal figure in semiconductor innovation. With a solid foundation of patents and collaborations with skilled professionals, Huang continues to be a driving force in advancing semiconductor technology, ensuring that the industry evolves and meets future demands.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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