The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 23, 2015
Filed:
Feb. 08, 2013
Applicant:
Taiwan Semiconductor Manufacturing Company, Ltd., Hsin-Chu, TW;
Inventors:
Chun-Hung Lin, Taipei, TW;
Ming-Che Ho, Tainan, TW;
Yu-Feng Chen, Hsin-Chu, TW;
Yi-Wen Wu, Xizhi, TW;
Hsien-Liang Meng, Hsin-Chu, TW;
Han-Ping Pu, Taichung, TW;
Assignee:
Taiwan Semiconductor Manufacturing Company, Ltd., Hsin-Chu, TW;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/44 (2006.01); H01L 21/48 (2006.01); H01L 23/00 (2006.01); H01L 23/31 (2006.01); H01L 25/10 (2006.01);
U.S. Cl.
CPC ...
H01L 23/562 (2013.01); H01L 24/81 (2013.01); H01L 2224/16225 (2013.01); H01L 2224/32225 (2013.01); H01L 2224/73204 (2013.01); H01L 2224/83192 (2013.01); H01L 24/29 (2013.01); H01L 24/83 (2013.01); H01L 2224/2919 (2013.01); H01L 2224/81193 (2013.01); H01L 2224/81815 (2013.01); H01L 23/3128 (2013.01); H01L 23/3171 (2013.01); H01L 25/105 (2013.01);
Abstract
A system and method for a zero stand-off configuration are provided. An embodiment comprises forming a seal layer over a conductive region that is part of a first substrate and breaching the seal with a conductive member of a second substrate in order to bond the first substrate to the second substrate.