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For the Inventor, By the Inventor

Xizhi, Taiwan

Yi-Wen Wu

This inventor holds 88 USPTO granted patents and 11 published patent applications, primarily in Semiconductor Packaging (CPC class H01L2224-0401). Top assignee: Taiwan Semiconductor Manufacturing Comp. Ltd.. Active years: 2012-2026.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Yi-Wen Wu. Retrieved from https://idiyas.com/inventor/yi-wen-wu

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 88 

% Patents Active = 86.4

Average Co-Inventor Count = 4.4

ph-index = 6

Forward Citations = 211(Granted Patents)

Forward Citations (Not Self Cited) = 188(Dec 10, 2025)


Inventors with similar research interests:

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Location History:

  • Hsin-Chu, TW (2015 - 2017)
  • Taipei, TW (2018)
  • Taipei County, TW (2021)
  • Xizhi, TW (2012 - 2023)
  • New Taipei, TW (2018 - 2024)

Company Filing History:

goldMedal88 out of 42,872 
 
Taiwan Semiconductor Manufacturing Comp. Ltd.
 patents

Years Active: 2012-2026

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Areas of Expertise:
Semiconductor Packaging
Fan-Out Feature
Hybrid Micro-Bump
Interposer Structure
3D SiP
Wafer Level Mold
Adhesive Element
Conductive Support
Bonding Structures
Routing Techniques
Integrated Circuits
Manufacturing Methods
88 patents (USPTO):Explore Patents
1. 12702043 - High-density microbump arrays with enhanced adhesion and methods of forming the same (2026-08-04),
2. 12635509 - Package structure (2026-05-19),
3. 12532771 - Package structure with fan-out feature (2026-01-20),
4. 12525556 - Semiconductor devices and methods of manufacture (2026-01-13),
5. 12476198 - Package structure with adhesive element over semiconductor chip (2025-11-18),
6. 12412857 - Hybrid micro-bump integration with redistribution layer (2025-09-09),
7. 12388028 - Package structure (2025-08-12),
8. 12308322 - Dual-sided routing in 3D semiconductor system-in-package structure and methods of forming the same (2025-05-20),
9. 12308313 - Semiconductor package with improved interposer structure (2025-05-20),
10. 12300598 - Package structure and method of fabricating the same (2025-05-13),
11. 12237262 - Semiconductor package with improved interposer structure (2025-02-25),
12. 12176337 - Semiconductor devices and methods of manufacturing (2024-12-24),
13. 12094819 - Method for forming package structure (2024-09-17),
14. 12051654 - Package structure and method of fabricating the same (2024-07-30),
15. 11901279 - Semiconductor package and method of manufacturing the same (2024-02-13),

Title: The Innovative Journey of Inventor Yi-Wen Wu

Introduction: Yi-Wen Wu, a talented inventor hailing from Xizhi, Taiwan, has made significant contributions to the field of technology through his groundbreaking inventions and patents.

Latest Patents: Yi-Wen Wu's latest patents include cutting-edge technologies in the fields of artificial intelligence, renewable energy, and biotechnology, showcasing his versatility and forward-thinking approach to innovation.

Career Highlights: Throughout his illustrious career, Yi-Wen Wu has been recognized for his exceptional problem-solving skills and creativity, leading to the development of revolutionary products that have had a profound impact on various industries.

Collaborations: Yi-Wen Wu has collaborated with leading research institutions, universities, and tech companies around the world, fostering a culture of innovation and knowledge-sharing that has propelled his inventions to new heights.

Conclusion: In conclusion, Yi-Wen Wu's passion for innovation, coupled with his dedication to pushing the boundaries of technology, has solidified his reputation as a visionary inventor whose work continues to inspire and shape the future of the industry.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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