Taiwan Semiconductor Manufacturing Comp. Ltd.

Yi-Wen Wu

Chung-Shi Liu

Ming-Che Ho

Hung-Jui Kuo

Shin-Puu Jeng

Po-Yao Chuang

Po-Hao Tsai

Chien Ling Hwang

Techi Wong

Shih-Ting Hung

Meng-Liang Lin

Wen-Hsiung Lu

Zheng-Yi Lim

Ming-Da Cheng

Chen-Hua Douglas Yu

Chih-Wei Lin

Tzong-Hann Yang

Hsien-Wei Chen

Mirng-Ji Lii

Hsiu-Jen Lin

Chia-Wei Tu

Tzung-Hui Lee

Alexander Kalnitsky

Yu-Hsiang Hu

Kai-Chiang Wu

Chun-Chieh Wang

Shih-Wei Liang

Chin-Yu Ku

Cheng-Chung Lin

Ching-Hui Chen

Han-Ping Pu

Chun-Hung Lin

Yu-Feng Chen

Hui-Jung Tsai

Kuo-Chio Liu

Yu-Peng Tsai

Ting-Li Yang

Hsien-Liang Meng

Sheng-Pin Yang

Hao-Chun Liu

Tsung-Shu Lin

Hsien-Wen Liu

Chien-Ling Hwang

Ching-Wen Chen

Chia-Tung Chang

Kio-Chio Liu

Tzong-Huann Yang

A package structure is provided. The package structure includes a redistribution structure and a semiconductor chip over the redistribution structure. The package structure also includes an adhesive element over the semiconductor chip. Opposite outermost edges of the adhesive element are laterally between opposite outermost edges of the redistribution structure. The package structure further includes a protective layer laterally surrounding the semiconductor chip and the adhesive element. In addition, the package structure includes a thermal conductive element over the semiconductor chip. The thermal conductive element is surrounded by the adhesive element.

Package structure with adhesive element over semiconductor chip

A semiconductor device includes a substrate; an interconnect structure over the substrate; a first passivation layer over the interconnect structure; a first conductive pad, a second conductive pad, and a conductive line disposed over the first passivation layer and electrically coupled to conductive features of the interconnect structure; a conformal second passivation layer over and extending along upper surfaces and sidewalls of the first conductive pad, the second conductive pad, and the conductive line; a first conductive bump and a second conductive bump over the first conductive pad and the second conductive pad, respectively, where the first conductive bump and the second conductive bump extend through the conformal second passivation layer and are electrically coupled to the first conductive pad and the second conductive pad, respectively; and a dummy bump over the conductive line, where the dummy bump is separated from the conductive line by the conformal second passivation layer.

Hybrid micro-bump integration with redistribution layer

A package structure includes a redistribution structure, a first semiconductor die, a first passive component, a second semiconductor die, a first insulating encapsulant, a second insulating encapsulant, a second passive component and a global shielding structure. The redistribution structure includes dielectric layers and conductive layers alternately stacked. The first semiconductor die, the first passive component and the second semiconductor die are disposed on a first surface of the redistribution structure. The first insulating encapsulant is encapsulating the first semiconductor die and the first passive component. The second insulating encapsulant is encapsulating the second semiconductor die, wherein the second insulating encapsulant is separated from the first insulating encapsulant. The second passive component is disposed on a second surface of the redistribution structure. The global shielding structure is surrounding the first insulating encapsulant, the second insulating encapsulant, and covering sidewalls of the redistribution structure.

Package structure

A semiconductor package is fabricated by attaching a first component to a second component. The first component is assembled by forming a first redistribution structure over a substrate. A through via is then formed over the first redistribution structure, and a die is attached to the first redistribution structure active-side down. The second component includes a second redistribution structure, which is then attached to the through via. A molding compound is deposited between the first redistribution structure and the second redistribution structure and further around the sides of the second component.

Dual-sided routing in 3D semiconductor system-in-package structure and methods of forming the same

A semiconductor package is provided. The semiconductor package includes a redistribution structure, a semiconductor die, and an interposer structure. The interposer structure includes an insulating base having a first surface facing the semiconductor die and a second surface opposite to the first surface and conductive features formed over the insulating base. The conductive features include first portions on the first surface of the insulating base and vertically overlapping the semiconductor die, second portions on the first surface of the insulating base and located outside a projection area of the semiconductor die in a top view, third portions on the second surface of the insulating base and vertically overlapping the semiconductor die, and fourth portions on the second surface of the insulating base and located outside the projection area of the semiconductor die in the top view. The interposer structure includes capping layers and dielectric features.

Semiconductor package with improved interposer structure

Provided is a package structure including a die; an electrically connecting structure having a die attach region and a peripheral region surrounding the die attach region, wherein the die is disposed on the electrically connecting structure within the die attach region; an insulating protrusion disposed in the peripheral region and extending in a thickness direction of the die; a conductive structure disposed on the electrically connecting structure and encapsulating the insulating protrusion, wherein the conductive structure is electrically coupled to the electrically connecting structure and the die; and a dielectric structure disposed on the electrically connecting structure and encapsulating the die and the conductive structure.

Package structure and method of fabricating the same

A semiconductor package is provided. The semiconductor package includes an encapsulating layer, a semiconductor die formed in the encapsulating layer, and an interposer structure covering the encapsulating layer. The interposer structure includes an insulating base having a first surface facing the encapsulating layer, and a second surface opposite the first surface. The interposer structure also includes insulating features formed on the first surface of the insulating base and extending into the encapsulating layer. The insulating features is arranged in a matrix and faces a top surface of the semiconductor die. The interposer structure further includes first conductive features formed on the first surface of the insulating base and extending into the encapsulating layer. The first conductive features surround the matrix of the insulating features.

Packaged devices and methods of manufacturing the devices are described herein. The packaged devices may be fabricated using heterogeneous devices and asymmetric dual-side molding on a multi-layered redistribution layer (RDL) structure. The packaged devices may be formed with a heterogeneous three-dimensional (3D) Fan-Out System-in-Package (SiP) structure having small profiles and can be formed using a single carrier substrate.

Semiconductor devices and methods of manufacturing

A method for forming a package structure is provided. The method includes forming a first interconnect structure over a carrier substrate and disposing a first die structure over the first interconnect structure. The method includes forming a dam structure over the first die structure. The method also includes forming a protection layer over a second interconnect structure. The method further includes bonding the second interconnect structure over the dam structure. In addition, the method includes forming a package layer between the first interconnect structure and the second interconnect structure. The method also includes removing the protection layer.

Method for forming package structure

A semiconductor package and a method of manufacturing the same are provided. The semiconductor package includes a semiconductor die, an encapsulant and a redistribution structure. The encapsulant laterally encapsulates the semiconductor die. The redistribution structure is disposed on the encapsulant and electrically connected with the semiconductor die, wherein the redistribution structure comprises a first conductive via, a first conductive wiring layer and a second conductive via stacked along a stacking direction, the first conductive via has a first terminal surface contacting the first conductive wiring layer, the second conductive via has a second terminal surface contacting the first conductive wiring layer, an area of a first cross section of the first conductive via is greater than an area of the first terminal surface of the first conductive via, and an area of a second cross section of the second conductive via is greater than an area of the second terminal surface of the second conductive via.

Semiconductor package and method of manufacturing the same

A semiconductor device and method of manufacturing is provided, whereby a support structure is utilized to provide additional support for a conductive element in order to eliminate or reduce the formation of a defective surface such that the conductive element may be formed to have a thinner structure without suffering deleterious structures.

Semiconductor device and method

A semiconductor package is provided. The semiconductor package includes an encapsulating layer, a semiconductor die formed in the encapsulating layer, and an interposer structure covering the encapsulating layer. The interposer structure includes an insulating base having a first surface facing the encapsulating layer, and a second surface opposite the first surface. The interposer structure also includes insulting features formed on the first surface of the insulating base and extending into the encapsulating layer. The insulting features are arranged in a matrix and face a top surface of the semiconductor die. The interposer structure further includes first conductive features formed on the first surface of the insulating base and extending into the encapsulating layer. The first conductive features surround the matrix of the plurality of insulting features.

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Xizhi, Taiwan

Yi-Wen Wu