The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 10, 2021
Filed:
Nov. 11, 2019
Taiwan Semiconductor Manufacturing Co., Ltd., Hsinchu, TW;
Chih-Hao Lin, Hsinchu, TW;
Chien-Kuo Chang, Zhubei, TW;
Pu-Sheng Lee, Zhubei, TW;
Fu-Jen Li, Hsinchu, TW;
Hsien-Liang Meng, Hsinchu, TW;
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD., Hsinchu, TW;
Abstract
A package includes a die on a surface of a package component. The package also includes a first die stack on the surface of the package component. The package further includes a first thermal interface material (TIM) having a first thermal conductivity and disposed on the first die stack. In addition, the package includes a second thermal interface material (TIM) having a second thermal conductivity and disposed on the die. The first thermal conductivity of the first TIM is different from the second thermal conductivity of the second TIM.